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Slawomir StanczakTechnische Universität Berlin and Fraunhofer HHIVerified email at tu-berlin.de
Paolo BaraccaBell Labs, NokiaVerified email at nokia-bell-labs.com
Hafiz ImtiazGraduate Student, Rutgers UniversityVerified email at rutgers.edu
Anand SarwateAssociate Professor, Rutgers UniversityVerified email at rutgers.edu
Ali ZaidiEricsson, SwedenVerified email at ericsson.com
Richard J. WeilerDeutsche TelekomVerified email at hhi.fraunhofer.de
Yue RongProfessor at Curtin UniversityVerified email at curtin.edu.au
Feifei GaoAssociate Professor at Tsinghua University, IEEEFellowVerified email at ieee.org
Alessandro BrighentePostdoc researcher, University of PadovaVerified email at unipd.it
Jan SchreckIntel CooperationVerified email at intel.com
Federico PennaSamsung Semiconductor, Inc.Verified email at samsung.com
Jalal EtesamiUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
Wen Chen, CIE Fellow, IEEE DLShanghai Jiao Tong University, Editor, IEEE TWC/TCOM/ACCESS/OJVTVerified email at sjtu.edu.cn
Steffen LimmerSiemens AGVerified email at siemens.com
Wei ChenState Key Lab of CAD&CG, Zhejiang universityVerified email at cad.zju.edu.cn