Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and TSVs MO Hossen, B Chava, G Van der Plas, E Beyne, MS Bakir
IEEE Transactions on Electron Devices 67 (1), 11-17, 2019
34 2019 Impact of high‐κ gate dielectric and other physical parameters on the electrostatics and threshold voltage of long channel gate‐all‐around nanowire transistor SUZ Khan, MS Hossain, FU Rahman, R Zaman, MO Hossen, ...
International Journal of Numerical Modelling: Electronic Networks, Devices …, 2015
17 2015 Beol-embedded 3d polylithic integration: Thermal and interconnection considerations A Kaul, SK Rajan, MO Hossen, GS May, MS Bakir
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1459-1467, 2020
14 2020 Power delivery network modeling and benchmarking for emerging heterogeneous integration technologies Y Zhang, MO Hossen, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019
14 2019 Compact transient thermal model of microfluidically cooled three-dimensional stacked chips with pin-fin enhanced microgap Y Hu, MO Hossen, Z Wan, MS Bakir, Y Joshi
Journal of Electronic Packaging 143 (3), 031007, 2021
11 2021 Power delivery network benchmarking for interposer and bridge-chip-based 2.5-D integration Y Zhang, MO Hossen, MS Bakir
IEEE Electron Device Letters 39 (1), 99-102, 2017
10 2017 Analytical modeling of gate capacitance and drain current of gate-all-around Inx Ga1−x As nanowire MOSFET SUZ Khan, MS Hossain, MO Hossen, FU Rahman, R Zaman, ...
2014 2nd International Conference on Electronic Design (ICED), 89-93, 2014
10 2014 Thermomechanical analysis and package-level optimization of mechanically flexible interconnects for interposer-on-motherboard assembly MO Hossen, JL Gonzalez, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018
8 2018 Capacitance-voltage characteristics of gate-all-around InxGa1-xAs nanowire transistor QDM Khosru, SUZ Khan, MS Hossain, FU Rahman, MO Hossen, ...
ECS Transactions 53 (1), 169, 2013
6 2013 Thermal-power delivery network co-analysis for multi-die integration MO Hossen, Y Zhang, MS Bakir
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018
5 2018 Heterogeneous multi-die stitching: Technology demonstration and design considerations PK Jo, MO Hossen, X Zhang, Y Zhang, MS Bakir
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1512-1518, 2018
4 2018 Uncoupled mode space approach towards transport modeling of Gate-All-Around Inx Ga1−x As nanowire MOSFET SUZ Khan, MS Hossain, FU Rahman, R Zaman, MO Hossen, ...
8th International Conference on Electrical and Computer Engineering, 100-103, 2014
4 2014 Self-consistent determination of threshold voltage of In-rich Gate-All-Around Inx Ga1−x As nanowire transistor incorporating quantum mechanical effect R Zaman, SUZ Khan, MS Hossain, FU Rahman, MO Hossen, ...
2012 7th International Conference on Electrical and Computer Engineering …, 2012
3 2012 Analysis of power delivery network (pdn) in bridge-chips for 2.5-d heterogeneous integration MO Hossen, A Kaul, E Nurvitadhi, MD Pant, R Gutala, A Dasu, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022
2 2022 Ballistic performance limit and gate leakage modeling of Rectangular Gate-all-around InGaAs Nanowire Transistors with ALD Al2 O3 as Gate Dielectric MO Hossen, MS Hossain, SUZ Khan, FU Rahman, R Zaman, ...
2012 IEEE International Conference on Electron Devices and Solid State …, 2012
2 2012 Design Space Exploration of Power Delivery For Advanced Packaging Technologies MO Hossen, Y Zhang, H Fathi Moghadam, Y Zhang, M Dayringer, ...
https://arxiv.org/abs/2008.03124, 2020
1 2020 Self-consistent capacitance-voltage characterization of gate-all-around graded nanowire transistor SUZ Khan, MS Hossain, MO Hossen, FU Rahman, R Zaman, ...
arXiv preprint arXiv:1406.5257, 2014
1 2014 Analytical modeling of potential profile and threshold voltage for rectangular gate-all-around III–V nanowire MOSFETs with ATLAS verification MS Hossain, SUZ Khan, MO Hossen, FU Rahman, R Zaman, ...
2012 IEEE International Conference on Electron Devices and Solid State …, 2012
1 2012 Design Considerations for Power Delivery Network and Metal-Insulator-Metal Capacitor Integration in Bridge-Chips for 2.5-D Heterogeneous Integration A Kaul, MO Hossen, M Manley, MS Bakir
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 985-990, 2023
2023 Power Delivery and Thermal Considerations for 2.5-D and 3-D Integration Technologies MO Hossen
Georgia Institute of Technology, 2019
2019