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- Jason KenneyApplied MaterialsVerified email at amat.com
- Ken CollinsVice President of Engineering and Fellow at Applied MaterialsVerified email at amat.com
- Mark J. KushnerUniversity of MichiganVerified email at umich.edu
- Leonid DorfApplied MaterialsVerified email at amat.com
- Samer BannaTechnion, Israel Institute of Technology, Applied MaterialsVerified email at amat.com
- Mingfeng WuZenStone Venture CapitalVerified email at utexas.edu
- Jun-Chieh WangApplied Materials, University of MichiganVerified email at umich.edu
- Julian SchulzeProfessor (Ruhr-University Bochum)Verified email at aept.rub.de
- S. Samukawa, Seiji SamukawaInstitute of Fluid Science and Advanced Institute for Material Research, Tohoku UniversityVerified email at ifs.tohoku.ac.jp
- Thorsten LillClarycon Nanotechnology ResearchVerified email at claryconresearch.com
- Igor KaganovichPrinceton University, Princeton Plasma Physics LaboratoryVerified email at pppl.gov
- Syed M. AlamEverspin Technologies, Inc.Verified email at alum.mit.edu
- David R. BorisResearch Physicist, U. S. Naval Research LaboratoryVerified email at nrl.navy.mil
- Scott G WaltonNaval Research LaboratoryVerified email at nrl.navy.mil
- Prof. Dr. Marius OrlowskiVirginia Tech, Bradly Department of Electrical and Computer EngineeeringVerified email at vt.edu
- Ken HaraStanford UniversityVerified email at stanford.edu
- Aaron TheanNational University of SingaporeVerified email at nus.edu.sg
- Amr HaggagDistinguished Technical Staff, Corporate Quality, Freescale SemiconductorVerified email at freescale.com