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Co-authors
Yuan ShenAssociate Professor, EE, Tsinghua UniversityVerified email at tsinghua.edu.cn- Marco ChianiProfessor, University of BolognaVerified email at unibo.it
- Andrea ContiDE, CNIT at Univ. of FerraraVerified email at ieee.org
- Hyundong ShinProfessor, Department of Electronic Engineering, Kyung Hee UniversityVerified email at khu.ac.kr
- Andreas F. MolischProfessor of Electrical Engineering, University of Southern CaliforniaVerified email at usc.edu
- Jack WintersVerified email at ieee.org
- Tony Q.S. QuekFull Professor and ISTD Pillar Head, SUTDVerified email at ieee.org
- Pedro PintoMIT, EPFLVerified email at alum.mit.edu
- Henk WymeerschChalmers University of TechnologyVerified email at chalmers.se
- Santiago MazuelasBasque Center for Applied Mathematics-BCAMVerified email at bcamath.org
- Andrea GiorgettiUniversity of BolognaVerified email at unibo.it
- Alberto ZanellaCNR IEIITVerified email at cnr.it
- Ranjan K. MallikDepartment of Electrical Engineering, Indian Institute of Technology - DelhiVerified email at ee.iitd.ernet.in
- Aggelos BletsasProfessor, School of ECE, TU CreteVerified email at telecom.tuc.gr
- Dajana CassioliUniversity of L'AquilaVerified email at univaq.it
- yang-seok choiIntel corpVerified email at intel.com
- Chia-Chin ChongSamsungVerified email at samsung.com
- Wee Peng TayNanyang Technological UniversityVerified email at ntu.edu.sg
- Jaime LienGoogle, Inc.Verified email at google.com
- William Wei-Liang LiPostdoctoral Researcher, University of California, Santa BarbaraVerified email at ieee.org
Moe Win
NASA Jet Propulsion Laboratory, AT&T Research Labs, Massachusetts Institute of Technology (MIT)
Verified email at mit.edu - Homepage