| Fin patterning methods for increased process margin CY Tseng, CC Hung, CK Chen, CM Lai, HJ Lin, RG Liu, TS Gau, WL Lin US Patent 9,449,880, 2016 | 26 | 2016 |
| Lithographic technique incorporating varied pattern materials CY Tseng, CC Hung, CK Chen, DF Chen, RG Liu, TS Gau, WL Lin US Patent 9,991,132, 2018 | 17 | 2018 |
| High fin cut fabrication process LC Chou, CL Chen, CM Lai, CCY Young, CY Tseng, JT Tzeng, ... US Patent 9,679,994, 2017 | 11 | 2017 |
| Method for integrated circuit manufacturing SM Chang, CF Lee, CY Tseng US Patent 9,672,320, 2017 | 11 | 2017 |
| Fin patterning methods for increased process margins CY Tseng, WL Lin, LT Lin, RG Liu, M Cao US Patent 10,535,520, 2020 | 10 | 2020 |
| Method for forming semiconductor device structure CM Lai, SM Chang, WL Lin, CY Tseng, RG Liu US Patent 10,497,565, 2019 | 4 | 2019 |
| Method of manufacturing fins and semiconductor device which includes fins CL Chen, CM Lai, CCY Young, CY Tseng, JT Tzeng, SIO Kam-Tou, ... US Patent 10,074,657, 2018 | 4 | 2018 |
| Multiple directed self-assembly patterning process CY Tseng, CC Hung, CK Chen, KH Lo, RG Liu, TS Gau, WL Lin US Patent 9,530,660, 2016 | 3 | 2016 |
| An integrated system dynamics and discrete event supply chain simulation framework for supply chain resilience with non-stationary pandemic demand MC Camur, AE Thanos, W Yund, CY Tseng, CC White, E Iakovou 2023 Winter Simulation Conference (WSC), 1617-1628, 2023 | 2 | 2023 |
| Method of patterning CY Tseng, YT Shen, WL Lin, CM Lai, KC Ching, SN Ju, LT Lin, RG Liu US Patent 11,901,190, 2024 | 1 | 2024 |
| Deep reinforcement learning approach for dynamic capacity planning in decentralised regenerative medicine supply chains CY Tseng, J Li, LH Lin, K Wang, CC White III, B Wang International Journal of Production Research, 1-16, 2023 | 1 | 2023 |
| High-density semiconductor device LC Chou, CL Chen, CM Lai, CCY Young, CY Tseng, HC Chen, SN Ju, ... US Patent 10,950,456, 2021 | 1 | 2021 |
| Semiconductor device which includes Fins CL Chen, CM Lai, CCY Young, CY Tseng, JT Tzeng, SIO Kam-Tou, ... US Patent 10,714,485, 2020 | 1 | 2020 |
| Method for forming semiconductor device structure CM Lai, SM Chang, WL Lin, CY Tseng, RG Liu US Patent 11,848,208, 2023 | | 2023 |
| A simulation-based comparison of centralized and point-of-care supply chain strategies for autologous cell therapy K Wang, CY Tseng, Z Li, C White, B Wang, BL Levine, AD Fesnak Cytotherapy 25 (12), 1370-1379, 2023 | | 2023 |
| Method of making semiconductor device which includes fins CL Chen, CM Lai, CCY Young, CY Tseng, JT Tzeng, SIO Kam-Tou, ... US Patent App. 18/190,670, 2023 | | 2023 |
| Method of making semiconductor device which includes Fins CL Chen, CM Lai, CCY Young, CY Tseng, JT Tzeng, SIO Kam-Tou, ... US Patent 11,616,067, 2023 | | 2023 |
| High-density semiconductor device LC Chou, CL Chen, CM Lai, CCY Young, CY Tseng, HC Chen, SN Ju, ... US Patent 11,532,482, 2022 | | 2022 |
| Method of patterning CY Tseng, YT Shen, WL Lin, CM Lai, KC Ching, SN Ju, LT Lin, RG Liu US Patent App. 17/873,113, 2022 | | 2022 |
| Method for forming semiconductor device structure CM Lai, SM Chang, WL Lin, CY Tseng, RG Liu US Patent 11,437,239, 2022 | | 2022 |
