Takip et
Duane Boning
Alıntı yapanlar
Alıntı yapanlar
Towards Fast Computation of Certified Robustness for ReLU Networks
TW Weng, H Zhang, H Chen, Z Song, CJ Hsieh, D Boning, IS Dhillong, ...
International Conference on Machine Learning (ICML) PMLR 80, 5276-5285, 2018
Design for manufacturability and statistical design: a constructive approach
M Orshansky, S Nassif, D Boning
Springer Science & Business Media, 2007
Analysis and decomposition of spatial variation in integrated circuit processes and devices
BE Stine, DS Boning, JE Chung
IEEE Transactions on Semiconductor Manufacturing 10 (1), 24-41, 1997
Models of process variations in device and interconnect
DS Boning, S Nassif
Design of High Performance Microprocessor Circuits, 98-115, 2000
The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes
BE Stine, DS Boning, JE Chung, L Camilletti, F Kruppa, ER Equi, W Loh, ...
IEEE Transactions on Electron Devices 45 (3), 665-679, 1998
Run by run control of chemical-mechanical polishing
DS Boning, WP Moyne, TH Smith, J Moyne, R Telfeyan, A Hurwitz, ...
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996
Towards stable and efficient training of verifiably robust neural networks
H Zhang, H Chen, C Xiao, S Gowal, R Stanforth, B Li, D Boning, CJ Hsieh
arXiv preprint arXiv:1906.06316, 2019
Characterization and Modeling of Oxide Chemical-Mechanical Polishing Using Planarization Length and Pattern Density Concepts
DO Ouma, DS Boning, JE Chung, WG Easter, V Saxena, S Misra, ...
IEEE Transactions on Semiconductor Manufacturing 15 (2), 232-244, 2002
Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing
BE Stine, DO Ouma, RR Divecha, DS Boning, JE Chung, DL Hetherington, ...
Semiconductor Manufacturing, IEEE Transactions on 11 (1), 129-140, 1998
A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance
V Mehrotra, SL Sam, D Boning, A Chandrakasan, R Vallishayee, S Nassif
Proceedings of the 37th Annual Design Automation Conference, 172-175, 2000
A closed-form analytic model for ILD thickness variation in CMP processes
B Stine, D Ouma, R Divecha, D Boning, J Chung, DL Hetherington, I Ali, ...
Chemical-Mechanical Planarization for ULSI Multilevel Interconnect Confer …, 1997
A self-tuning EWMA controller utilizing artificial neural network function approximation techniques
TH Smith, DS Boning
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997
DOE/Opt: A system for design of experiments, response surface modeling, and optimization using process and device simulation
DS Boning, PK Mozumder
IEEE Transactions on Semiconductor Manufacturing 7 (2), 233-244, 1994
Modeling the effects of manufacturing variation on high-speed microprocessor interconnect performance
V Mehrotra, S Nassif, D Boning, J Chung
International Electron Devices Meeting 1998. Technical Digest (Cat. No …, 1998
An integrated characterization and modeling methodology for CMP dielectric planarization
D Ouma, D Boning, J Chung, G Shin, L Olsen, J Clark
Proceedings of the IEEE 1998 International Interconnect Technology …, 1998
The limitations of adversarial training and the blind-spot attack
H Zhang, H Chen, Z Song, D Boning, IS Dhillon, CJ Hsieh
arXiv preprint arXiv:1901.04684, 2019
Technology scaling impact of variation on clock skew and interconnect delay
V Mehrotra, D Boning
Proceedings of the IEEE 2001 International Interconnect Technology …, 2001
Run by Run Advanced Process Control of Metal Sputter Deposition
T Smith, D Boning, J Stefani, SW Butler
Proc. of the Second International Symposium on Process Control, Diagnostics …, 1997
Robust deep reinforcement learning against adversarial perturbations on state observations
H Zhang, H Chen, C Xiao, B Li, M Liu, D Boning, CJ Hsieh
Advances in Neural Information Processing Systems 33, 21024-21037, 2020
Simultaneous fault detection and classification for semiconductor manufacturing tools
BE Goodlin, DS Boning, HH Sawin, BM Wise
Journal of the Electrochemical Society 150 (12), G778, 2003
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Makaleler 1–20