Yang Wan
Yang Wan
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Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective
M Jung, T Song, Y Wan, Y Peng, SK Lim
2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC), 1-6, 2014
342014
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
X Zhao, Y Wan, M Scheuermann, SK Lim
2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 363-370, 2013
302013
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core
M Jung, T Song, Y Wan, YJ Lee, D Mohapatra, H Wang, G Taylor, ...
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 1-4, 2013
242013
Topic-level social network search
J Tang, S Wu, B Gao, Y Wan
Proceedings of the 17th ACM SIGKDD international conference on Knowledge …, 2011
202011
Thermal impact study of block folding and face-to-face bonding in 3D IC
Y Peng, M Jung, T Song, Y Wan, SK Lim
2015 IEEE International Interconnect Technology Conference and 2015 IEEE …, 2015
22015
3D IC power benefit study under practical design considerations
T Song, M Jung, Y Wan, Y Peng, SK Lim
2015 IEEE International Interconnect Technology Conference and 2015 IEEE …, 2015
22015
Sistem, işlemi şu anda gerçekleştiremiyor. Daha sonra yeniden deneyin.
Makaleler 1–6