| A Passive RFID Tag Embedded Temperature Sensor With Improved Process Spreads Immunity for a to 60 Sensing Range B Wang, MK Law, A Bermak, HC Luong IEEE Transactions on Circuits and Systems I: Regular Papers 61 (2), 337-346, 2014 | 56 | 2014 |
| Low-power CMOS image sensor based on column-parallel single-slope/SAR quantization scheme F Tang, DG Chen, B Wang, A Bermak IEEE Transactions on Electron Devices 60 (8), 2561-2566, 2013 | 48 | 2013 |
| A Column-Parallel Inverter-Based Cyclic ADC for CMOS Image Sensor With Capacitance and Clock Scaling F Tang, B Wang, A Bermak, X Zhou, S Hu, X He IEEE Transactions on Electron Devices 63 (1), 162 - 167, 2016 | 22 | 2016 |
| A Precision CMOS Voltage Reference Exploiting Silicon Bandgap Narrowing Effect B Wang, MK Law, A Bermak IEEE Transactions on Electron Devices 62 (7), 2128 - 2135, 2015 | 21 | 2015 |
| A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design W Xu, B Gao, M Ahmed, M Duan, B Wang, S Mohamad, A Bermak, ... 2017 IEEE 30th Intl' Conf. MEMS, 989-992, 2017 | 18 | 2017 |
| 80dB dynamic range 100KHz bandwidth inverter-based ΣΔ ADC for CMOS image sensor F Tang, B Wang, A Bermak 2012 IEEE International Symposium on Circuits and Systems (ISCAS), 3094-3097, 2012 | 11 | 2012 |
| CMOS on-chip stable true-random ID generation using antenna effect F Tang, DG Chen, B Wang, A Bermak, A Amira, S Mohamad IEEE Electron Device Letters 35 (1), 54-56, 2013 | 10 | 2013 |
| A three-dimensional integrated micro calorimetric flow sensor in CMOS MEMS technology W Xu, B Wang, M Duan, M Ahmed, A Bermak, YK Lee IEEE Sensors Letters 3 (2), 1-4, 2019 | 9 | 2019 |
| A 10.6 pJˇ K 2 Resolution FoM Temperature Sensor Using Astable Multivibrator B Wang, MK Law, CY Tsui, A Bermak IEEE Transactions on Circuits and Systems II: Express Briefs 65 (7), 869-873, 2018 | 9 | 2018 |
| A −12.3 dBm UHF Passive RFID Sense Tag for Grid Thermal Monitoring B Wang, MK Law, J Yi, CY Tsui, A Bermak IEEE Transactions on Industrial Electronics 66 (11), 8811-8820, 2019 | 8 | 2019 |
| A low power class-AB audio power amplifier with dynamic transconductance compensation in 55 nm CMOS process F Tang, S Li, B Wang, A Bermak, X Zhou, S Hu IEEE Transactions on Circuits and Systems I: Regular Papers 63 (9), 1360-1369, 2016 | 6 | 2016 |
| A reconfigurable time-domain comparator for multi-sensing applications X Zhong, B Wang, A Bermak 2015 IEEE International Symposium on Circuits and Systems (ISCAS), 349-352, 2015 | 6 | 2015 |
| A low-cost capacitive relative humidity sensor for food moisture monitoring application B Wang, MK Law, A Bermak 2012 4th Asia Symposium on Quality Electronic Design (ASQED), 95-99, 2012 | 6 | 2012 |
| A Low-Cost Strain Gauge Displacement Sensor Fabricated via Shadow Mask Printing Y Yi, B Wang, A Bermak Sensors 19 (21), 4713, 2019 | 5 | 2019 |
| Wide dynamic range PSD algorithms and their implementation for compressive imaging B Zhang, X Zhong, B Wang, PV Sander, A Bermak 2016 IEEE International Symposium on Circuits and Systems (ISCAS), 2727-2730, 2016 | 5 | 2016 |
| A new approach for an ultra-thin piezoresistive sensor based on solidified carbon ink film Y Yi, A Samara, B Wang Journal of Materials Science 56 (1), 607-614, 2020 | 4 | 2020 |
| BJT Process Spread Compensation Utilizing Base Recombination Current in Standard CMOS B Wang, MK Law, A Bermak, F Tang IEEE Electron Device Letters 36 (11), 1111 - 1113, 2015 | 4 | 2015 |
| A sub-1V BJT-based CMOS temperature sensor from− 55° C to 125° C B Wang, MK Law, F Tang, A Bermak 2012 IEEE International Symposium on Circuits and Systems (ISCAS), 3114-3117, 2012 | 4 | 2012 |
| An Inkjet-printed Strain Sensor with a Carbon-SilverPolyimide Topology Y Yi, S Ali, B Wang 2019 IEEE International Conference on Flexible and Printable Sensors and …, 2019 | 3 | 2019 |
| A 2.2uW 15b incremental delta-sigma ADC with output-driven input segmentation B Wang, MK Law, S Mohamad, A Bermak 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 7-8, 2016 | 3 | 2016 |
Amine Bermak, IEEE FellowProfessor, College of Science and Engineering, Hamad Bin Khalifa University,Verified email at hbku.edu.qa
