Madhavan Swaminathan
Madhavan Swaminathan
John Pippin Chair in Microsystems Packaging and Electromagnetics, School of ECE
ece.gatech.edu üzerinde doğrulanmış e-posta adresine sahip - Ana Sayfa
Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
Power integrity modeling and design for semiconductors and systems
M Swaminathan, E Engin
Pearson Education, 2007
4292007
Power distribution networks for system-on-package: Status and challenges
M Swaminathan, J Kim, I Novak, JP Libous
IEEE Transactions on Advanced Packaging 27 (2), 286-300, 2004
3162004
Modeling and transient simulation of planes in electronic packages
N Na, J Choi, S Chun, M Swaminathan, J Srinivasan
IEEE Transactions on Advanced Packaging 23 (3), 340-352, 2000
1902000
Impact of power-supply noise on timing in high-frequency microprocessors
M Saint-Laurent, M Swaminathan
IEEE Transactions on Advanced Packaging 27 (1), 135-144, 2004
1882004
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
1792004
Modeling of irregular shaped power distribution planes using transmission matrix method
JH Kim, M Swaminathan
IEEE Transactions on advanced packaging 24 (3), 334-346, 2001
1662001
System on package: miniaturization of the entire system
RR Tummala
McGraw-Hill Education, 2008
1592008
A novel integrated decoupling capacitor for MCM-L technology
P Chahal, RR Tummala, MG Allen, M Swaminathan
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
1461998
Modeling of simultaneous switching noise in high speed systems
S Chun, M Swaminathan, LD Smith, J Srinivasan, Z Jin, MK Iyer
IEEE Transactions on Advanced Packaging 24 (2), 132-142, 2001
1432001
Designing and modeling for power integrity
M Swaminathan, D Chung, S Grivet-Talocia, K Bharath, V Laddha, J Xie
IEEE Transactions on Electromagnetic Compatibility 52 (2), 288-310, 2010
1402010
Electrical modeling of through silicon and package vias
T Bandyopadhyay, R Chatterjee, D Chung, M Swaminathan, R Tummala
2009 IEEE International Conference on 3D System Integration, 1-8, 2009
1392009
High density memory structure
MF Mcallister, JA Mcdonald, GJ Robbins, M Swaminathan, GM Wilkins
US Patent 5,523,619, 1996
1351996
A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications
J Choi, V Govind, M Swaminathan
Proceedings. 2004 IEEE Radio and Wireless Conference (IEEE Cat. No. 04TH8746 …, 2004
1162004
Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
KJ Han, M Swaminathan, T Bandyopadhyay
IEEE Transactions on Advanced Packaging 33 (4), 804-817, 2010
1152010
Method for fabricating three-dimensional all organic interconnect structures
GE White, M Swaminathan, V Sundaram, S Dalmia
US Patent 7,805,834, 2010
1122010
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
T Bandyopadhyay, KJ Han, D Chung, R Chatterjee, M Swaminathan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6 …, 2011
1072011
Introduction to System on Package (SOP).
R Tummala, M Swaminathan
McGraw-Hill Professional Publishing, 2007
1052007
Computation of cutoff wavenumbers of TE and TM modes in waveguides of arbitrary cross sections using a surface integral formulation
M Swaminathan, E Arvas, TK Sarkar, AR Djordjevic
IEEE transactions on microwave theory and techniques 38 (2), 154-159, 1990
1021990
Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes
AE Engin, K Bharath, M Swaminathan
IEEE Transactions on Electromagnetic Compatibility 49 (2), 441-447, 2007
982007
Electrical-thermal co-simulation of 3D integrated systems with micro-fluidic cooling and Joule heating effects
J Xie, M Swaminathan
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011
952011
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Makaleler 1–20