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Shuo Huang
Shuo Huang
KLA Corporation
Verified email at kla.com
Title
Cited by
Cited by
Year
A general memristor-based partial differential equation solver
MA Zidan, YJ Jeong, J Lee, B Chen, S Huang, MJ Kushner, WD Lu
Nature Electronics 1 (7), 411-420, 2018
2122018
Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation
S Huang, C Huard, S Shim, SK Nam, IC Song, S Lu, MJ Kushner
Journal of Vacuum Science & Technology A 37 (3), 2019
732019
Calculated cross sections for electron collisions with NF3, NF2 and NF with applications to remote plasma sources
JR Hamilton, J Tennyson, S Huang, MJ Kushner
Plasma Sources Science and Technology 26 (6), 065010, 2017
502017
Pattern dependent profile distortion during plasma etching of high aspect ratio features in SiO2
S Huang, S Shim, SK Nam, MJ Kushner
Journal of Vacuum Science & Technology A 38 (2), 2020
452020
A particle-in-cell/Monte Carlo simulation of a capacitively coupled chlorine discharge
S Huang, JT Gudmundsson
Plasma Sources Science and Technology 22 (5), 055020, 2013
312013
Insights to scaling remote plasma sources sustained in NF3 mixtures
S Huang, V Volynets, JR Hamilton, S Lee, IC Song, S Lu, J Tennyson, ...
Journal of Vacuum Science & Technology A 35 (3), 2017
282017
Highly selective Si3N4/SiO2 etching using an NF3/N2/O2/H2 remote plasma. I. Plasma source and critical fluxes
V Volynets, Y Barsukov, G Kim, JE Jung, SK Nam, K Han, S Huang, ...
Journal of Vacuum Science & Technology A 38 (2), 2020
232020
Downstream etching of silicon nitride using continuous-wave and pulsed remote plasma sources sustained in Ar/NF3/O2 mixtures
S Huang, V Volynets, JR Hamilton, SK Nam, IC Song, S Lu, J Tennyson, ...
Journal of Vacuum Science & Technology A 36 (2), 2018
212018
Highly selective Si3N4/SiO2 etching using an NF3/N2/O2/H2 remote plasma. II. Surface reaction mechanism
JE Jung, Y Barsukov, V Volynets, G Kim, SK Nam, K Han, S Huang, ...
Journal of Vacuum Science & Technology A 38 (2), 2020
182020
Highly selective Si3N4/SiO2 etching using an NF3
V Volynets, Y Barsukov, G Kim, JE Jung, SK Nam, K Han, S Huang, ...
N2, 2020
132020
Dual-frequency capacitively coupled chlorine discharge
S Huang, JT Gudmundsson
Plasma Sources Science and Technology 24 (1), 015003, 2015
132015
A current driven capacitively coupled chlorine discharge
S Huang, JT Gudmundsson
Plasma Sources Science and Technology 23 (2), 025015, 2014
132014
Ion energy and angular distributions in a dual-frequency capacitively coupled chlorine discharge
S Huang, JT Gudmundsson
IEEE Transactions on Plasma Science 42 (10), 2854-2855, 2014
102014
Microneedle penetrating array with axon-sized dimensions for cuff-less peripheral nerve interfacing
D Yan, A Jiman, D Ratze, S Huang, S Parizi, E Welle, Z Ouyang, P Patel, ...
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), 827-830, 2019
92019
Remote plasma sources sustained in NF3 mixtures
S Huang, JR Hamilton, J Tennyson, MJ Kushner
22nd International Symposium on Plasma Chemistry, Antwerp, Belgium, 2015
32015
A particle-in-cell/Monte Carlo simulation of a capacitively coupled chlorine discharge
JT Gudmundsson, S Huang
APS Meeting Abstracts, 2013
22013
Modeling of Downstream and Direct Plasma Systems for Highly Selective and Anisotropic Etching
S Huang
University of Michigan, 2019
12019
Optimizing uniformity in plasma etching of high aspect ratio features by engineering the focus ring
S Huang, MJ Kushner, S Shim, SK Nam
2018 IEEE International Conference on Plasma Science (ICOPS), 1-1, 2018
12018
Contact Edge Roughness In The Etching Of High Aspect Ratio Contacts In Sio2
S Huang, C Huard, MJ Kushner, S Shim, S Lee, IC Song, S Lu
2017 IEEE International Conference on Plasma Science (ICOPS), 1-1, 2017
12017
Optimizing remote plasma sources for selective etching
S Huang, MJ Kushner, V Volynets, S Lee, IC Song, S Lu, JR Hamilton, ...
2016 IEEE International Conference on Plasma Science (ICOPS), 1-1, 2016
12016
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Articles 1–20