| Steady-state heat conduction in multi-layer bodies A Haji-Sheikh, JV Beck, D Agonafer International Journal of Heat and Mass Transfer 46 (13), 2363-2379, 2003 | 110 | 2003 |
| Convertible cooling module for air or water cooling of electronic circuit components D Agonafer, TM Anderson, GM Chrysler, RCF Chu, RE Simons, DT Vader US Patent 5,370,178, 1994 | 110 | 1994 |
| Isothermal heat sink with tiered cooling channels D Agonafer, RC Chu, MJ Ellsworth Jr, RE Simons US Patent 6,337,794, 2002 | 99 | 2002 |
| Optimization of data center room layout to minimize rack inlet air temperature S Bhopte, D Agonafer, R Schmidt, B Sammakia | 90 | 2006 |
| A brief overview of recent developments in thermal management in data centers S Alkharabsheh, J Fernandes, B Gebrehiwot, D Agonafer, K Ghose, ... Journal of Electronic Packaging 137 (4), 2015 | 82 | 2015 |
| Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof D Agonafer, RC Chu, MJ Ellsworth Jr, RE Simons US Patent 6,431,260, 2002 | 80 | 2002 |
| The LVEL turbulence model for conjugate heat transfer at low Reynolds numbers D Agonafer, L Gan-Li, DB Spalding Application of CAE/CAD Electronic Systems, ASME 18, 23-26, 1996 | 79 | 1996 |
| Coarse and detailed CFD modelling of a finned heat sink RL Linton, D Agonaber Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in …, 1994 | 77 | 1994 |
| Fundamental cooling limits for high power density gallium nitride electronics Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (6 …, 2015 | 64 | 2015 |
| Cooling limits for GaN HEMT technology Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-5, 2013 | 61 | 2013 |
| Convertible heat exchanger for air or water cooling of electronic circuit components and the like D Agonafer, TM Anderson, GM Chrysler, RC Chu, RE Simons, DT Vader US Patent 5,482,113, 1996 | 56 | 1996 |
| Low Reynolds number flow across an array of cylindrical microposts in a microchannel and figure-of-merit analysis of micropost-filled microreactors J Yeom, DD Agonafer, JH Han, MA Shannon Journal of Micromechanics and Microengineering 19 (6), 065025, 2009 | 47 | 2009 |
| Effect of under floor blockages on data center performance S Bhopte, B Sammakia, R Schmidt, MK Iyengar, D Agonafer Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 47 | 2006 |
| Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices H Lee, DD Agonafer, Y Won, F Houshmand, C Gorle, M Asheghi, ... Journal of Electronic Packaging 138 (1), 2016 | 46 | 2016 |
| A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending L Xu, T Reinikainen, W Ren, BP Wang, Z Han, D Agonafer Microelectronics Reliability 44 (12), 1977-1983, 2004 | 42 | 2004 |
| Numerical modeling of forced convection heat transfer for modules mounted on circuit boards D Agonafer, DF Moffatt | 35 | 1990 |
| Air flow distribution in integrated circuit spot coolers D Agonafer, TM Anderson, GM Chrysler, RE Simons US Patent 5,704,419, 1998 | 34 | 1998 |
| Thermo-mechanical challenges in stacked packaging D Agonafer, A Kaisare, MM Hossain, Y Lee, BP Dewan-Sandur, ... Heat Transfer Engineering 29 (2), 134-148, 2008 | 33 | 2008 |
| Effects of mineral oil immersion cooling on IT equipment reliability and reliability enhancements to data center operations JM Shah, R Eiland, A Siddarth, D Agonafer 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 32 | 2016 |
| Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper JW Palko, H Lee, C Zhang, TJ Dusseault, T Maitra, Y Won, DD Agonafer, ... Advanced Functional Materials 27 (45), 1703265, 2017 | 30 | 2017 |
