Dereje Agonafer
Dereje Agonafer
Professor of Mechanical Engineering, University of Texas at Arlington üzerinde doğrulanmış e-posta adresine sahip
Alıntı yapanlar
Alıntı yapanlar
Steady-state heat conduction in multi-layer bodies
A Haji-Sheikh, JV Beck, D Agonafer
International Journal of Heat and Mass Transfer 46 (13), 2363-2379, 2003
Convertible cooling module for air or water cooling of electronic circuit components
D Agonafer, TM Anderson, GM Chrysler, RCF Chu, RE Simons, DT Vader
US Patent 5,370,178, 1994
Isothermal heat sink with tiered cooling channels
D Agonafer, RC Chu, MJ Ellsworth Jr, RE Simons
US Patent 6,337,794, 2002
Optimization of data center room layout to minimize rack inlet air temperature
S Bhopte, D Agonafer, R Schmidt, B Sammakia
A brief overview of recent developments in thermal management in data centers
S Alkharabsheh, J Fernandes, B Gebrehiwot, D Agonafer, K Ghose, ...
Journal of Electronic Packaging 137 (4), 2015
Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof
D Agonafer, RC Chu, MJ Ellsworth Jr, RE Simons
US Patent 6,431,260, 2002
The LVEL turbulence model for conjugate heat transfer at low Reynolds numbers
D Agonafer, L Gan-Li, DB Spalding
Application of CAE/CAD Electronic Systems, ASME 18, 23-26, 1996
Coarse and detailed CFD modelling of a finned heat sink
RL Linton, D Agonaber
Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in …, 1994
Fundamental cooling limits for high power density gallium nitride electronics
Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (6 …, 2015
Cooling limits for GaN HEMT technology
Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson
2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-5, 2013
Convertible heat exchanger for air or water cooling of electronic circuit components and the like
D Agonafer, TM Anderson, GM Chrysler, RC Chu, RE Simons, DT Vader
US Patent 5,482,113, 1996
Low Reynolds number flow across an array of cylindrical microposts in a microchannel and figure-of-merit analysis of micropost-filled microreactors
J Yeom, DD Agonafer, JH Han, MA Shannon
Journal of Micromechanics and Microengineering 19 (6), 065025, 2009
Effect of under floor blockages on data center performance
S Bhopte, B Sammakia, R Schmidt, MK Iyengar, D Agonafer
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices
H Lee, DD Agonafer, Y Won, F Houshmand, C Gorle, M Asheghi, ...
Journal of Electronic Packaging 138 (1), 2016
A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending
L Xu, T Reinikainen, W Ren, BP Wang, Z Han, D Agonafer
Microelectronics Reliability 44 (12), 1977-1983, 2004
Numerical modeling of forced convection heat transfer for modules mounted on circuit boards
D Agonafer, DF Moffatt
Air flow distribution in integrated circuit spot coolers
D Agonafer, TM Anderson, GM Chrysler, RE Simons
US Patent 5,704,419, 1998
Thermo-mechanical challenges in stacked packaging
D Agonafer, A Kaisare, MM Hossain, Y Lee, BP Dewan-Sandur, ...
Heat Transfer Engineering 29 (2), 134-148, 2008
Effects of mineral oil immersion cooling on IT equipment reliability and reliability enhancements to data center operations
JM Shah, R Eiland, A Siddarth, D Agonafer
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper
JW Palko, H Lee, C Zhang, TJ Dusseault, T Maitra, Y Won, DD Agonafer, ...
Advanced Functional Materials 27 (45), 1703265, 2017
Sistem, işlemi şu anda gerçekleştiremiyor. Daha sonra yeniden deneyin.
Makaleler 1–20