| Ductile regime nanomachining of single-crystal silicon carbide J Patten, W Gao, K Yasuto | 215 | 2005 |
| Origins of the ductile regime in single‐point diamond turning of semiconductors JC Morris, DL Callahan, J Kulik, JA Patten, RO Scattergood Journal of the American Ceramic Society 78 (8), 2015-2020, 1995 | 166 | 1995 |
| Experimental work on micro laser-assisted diamond turning of silicon (111) H Mohammadi, D Ravindra, SK Kode, JA Patten Journal of Manufacturing Processes 19, 125-128, 2015 | 106 | 2015 |
| Ductile mode material removal and high-pressure phase transformation in silicon during micro-laser assisted machining D Ravindra, MK Ghantasala, J Patten Precision engineering 36 (2), 364-367, 2012 | 101 | 2012 |
| High-density amorphous phase of silicon carbide obtained under large plastic shear and high pressure VI Levitas, Y Ma, E Selvi, J Wu, JA Patten Physical Review B 85 (5), 054114, 2012 | 101 | 2012 |
| Construction and testing of a nanomachining instrument W Gao, RJ Hocken, JA Patten, J Lovingood, DA Lucca Precision Engineering 24 (4), 320-328, 2000 | 90 | 2000 |
| Extreme negative rake angle technique for single point diamond nano-cutting of silicon JA Patten, W Gao Precision Engineering 25 (2), 165-167, 2001 | 82 | 2001 |
| Nanoindentation tests on diamond-machined silicon wafers J Yan, H Takahashi, J Tamaki, X Gai, H Harada, J Patten Applied physics letters 86 (18), 2005 | 76 | 2005 |
| Comparison between numerical simulations and experiments for single-point diamond turning of single-crystal silicon carbide JA Patten, J Jacob Journal of manufacturing processes 10 (1), 28-33, 2008 | 69 | 2008 |
| Numerical simulations of ductile machining of silicon nitride with a cutting tool of defined geometry TG Kumbera, HP Cherukuri, JA Patten, CJ Brand, TD Marusich Taylor & Francis Group 5 (3), 341-352, 2001 | 66 | 2001 |
| Force analysis, mechanical energy and laser heating evaluation of scratch tests on silicon carbide (4H-SiC) in micro-laser assisted machining (µ-LAM) process AR Shayan, HB Poyraz, D Ravindra, M Ghantasala, JA Patten International Manufacturing Science and Engineering Conference 43611, 827-832, 2009 | 53 | 2009 |
| High-pressure phase transformation of silicon nitride J Patten, R Fesperman, S Kumar, S McSpadden, J Qu, M Lance, ... Applied physics letters 83 (23), 4740-4742, 2003 | 50 | 2003 |
| Ductile-regime machining of semiconductors and ceramics JA Patten, H Cherukuri, J Yan High pressure surface science and engineering, 543-632, 2019 | 48 | 2019 |
| Automatic vision inspection and measurement system for external screw threads RJ Hunsicker, J Patten, A Ledford, C Ferman, M Allen, C Ellis Journal of Manufacturing Systems 13 (5), 370-384, 1994 | 43 | 1994 |
| Experiments using a nano-machining instrument for nano-cutting brittle materials W Gao, RJ Hocken, JA Patten, J Lovingood CIRP Annals 49 (1), 439-442, 2000 | 38 | 2000 |
| Ductile regime single point diamond turning of quartz resulting in an improved and damage-free surface D Ravindra, J Patten Machining science and technology 15 (4), 357-375, 2011 | 34 | 2011 |
| Estimation of temperature distribution in silicon during micro laser assisted machining KJ Suthar, J Patten, L Dong, H Abdel-Aal International Manufacturing Science and Engineering Conference 48524, 301-309, 2008 | 30 | 2008 |
| Force measurement in a nanomachining instrument W Gao, RJ Hocken, JA Patten, J Lovingood Review of scientific instruments 71 (11), 4325-4329, 2000 | 30 | 2000 |
| Numerical simulations of ductile regime machining of silicon nitride using the Drucker-Prager material model SK Ajjarapu, JA Patten, H Cherukuri, C Brand Proceedings of the Institution of Mechanical Engineers, Part C: Journal of …, 2004 | 29 | 2004 |
| Pressure and temperature effects in micro-laser assisted machining (μ-LAM) of silicon carbide AR Shayan, HB Poyraz, D Ravindra, JA Patten Transactions NAMRI/SME 37, 75-80, 2009 | 27 | 2009 |
