Takip et
Zhiyuan Yang
Zhiyuan Yang
umd.edu üzerinde doğrulanmış e-posta adresine sahip - Ana Sayfa
Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
DRAMsim3: A cycle-accurate, thermal-capable DRAM simulator
S Li, Z Yang, D Reddy, A Srivastava, B Jacob
IEEE Computer Architecture Letters 19 (2), 106-109, 2020
1512020
TSV-based 3-D ICs: Design methods and tools
T Lu, C Serafy, Z Yang, SK Samal, SK Lim, A Srivastava
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2017
472017
Electromigration-aware placement for 3D-ICs
T Lu, Z Yang, A Srivastava
2016 17th International Symposium on Quality Electronic Design (ISQED), 35-40, 2016
142016
Thermoelectric codesign of 3-D CPUs and embedded microfluidic pin-fin heatsinks
C Serafy, Z Yang, A Srivastava, Y Hu, Y Joshi
IEEE Design & Test 33 (2), 40-48, 2015
122015
Physical design of 3D FPGAs embedded with micro-channel-based fluidic cooling
Z Yang, A Srivastava
Proceedings of the 2016 ACM/SIGDA International Symposium on Field …, 2016
82016
Phase-driven learning-based dynamic reliability management for multi-core processors
Z Yang, C Serafy, T Lu, A Srivastava
Proceedings of the 54th Annual Design Automation Conference 2017, 1-6, 2017
72017
Voltage noise induced DRAM soft error reduction technique for 3D-CPUs
T Lu, C Serafy, Z Yang, A Srivastava
Proceedings of the 2016 International Symposium on Low Power Electronics and …, 2016
62016
Post-placement optimization for thermal-induced mechanical stress reduction
T Lu, Z Yang, A Srivastava
2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 158-163, 2016
62016
Physical co-design for micro-fluidically cooled 3D ICs
Z Yang, A Srivastava
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
52016
Co-placement for pin-fin based micro-fluidically cooled 3D ICs
Z Yang, A Srivastava
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
42015
Value-driven synthesis for neural network ASICs
Z Yang, A Srivastava
Proceedings of the International Symposium on Low Power Electronics and …, 2018
32018
HMCTherm: A cycle-accurate HMC simulator integrated with detailed power and thermal simulation
Z Yang, M Zuzak, A Srivastava
Proceedings of the International Symposium on Memory Systems, 209-117, 2018
22018
Enhanced Phase-Driven -Learning-Based DRM for Multicore Processors
Z Yang, C Serafy, T Lu, A Srivastava
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018
12018
ECO based placement and routing framework for 3D FPGAs with micro-fluidic cooling
Z Yang, C Serafy, A Srivastava
2016 IEEE 24th Annual International Symposium on Field-Programmable Custom …, 2016
12016
Thermal, Power Delivery and Reliability Management for 3D ICS
Z Yang
University of Maryland, College Park, 2018
2018
Design Space Modeling and Simulation for Physically Constrained 3D CPUs
C Serafy, Z Yang, A Srivastava
Proceedings of the on Great Lakes Symposium on VLSI 2017, 375-380, 2017
2017
Sistem, işlemi şu anda gerçekleştiremiyor. Daha sonra yeniden deneyin.
Makaleler 1–16