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Co-authors
- Suman DattaJoseph M. Pettit Chair ProfessorVerified email at gatech.edu
- Arun V. ThathacharyPhD., Device Engineer, Intel Corp.Verified email at intel.com
- Vijaykrishnan NarayananRobert Noll Chair Professor at The Pennsylvania State UniversityVerified email at cse.psu.edu
- Huichu LiuIntel Labs, Intel CorporationVerified email at intel.com
- vinay saripalliPhD in computer Science and Engineering, Penn State UniversityVerified email at psu.edu
- Susan Trolier-McKinstrySteward S. Flaschen Professor of Ceramic Science and Engineering and Electrical Eng., Penn StateVerified email at psu.edu
- Souvik MahapatraProfessor, EE Dept, IIT Bombay (Fellow of IEEE, INSA, IASc, INAE)Verified email at ee.iitb.ac.in
- Lu LiuIntel CorporationVerified email at intel.com
- Dheeraj MohataSenior Integration Engineer, GCS IncVerified email at gcsincorp.com
- Marek HythaAtomera, IncVerified email at ieee.org
- Robert StephensonAtomera, Inc.Verified email at ieee.org
- Mirco CantoroSamsung ElectronicsVerified email at samsung.com
- Ruchit MehtaPurdue UniversityVerified email at juniper.net
- Maryam Shojaei BaghiniProfessor of Electrical Engineering, IIT-BombayVerified email at iitb.ac.in
- Mayank ShrivastavaIndian Institute of Science BangaloreVerified email at iisc.ac.in
- Shashank GuptaPhD student, Stanford UniversityVerified email at stanford.edu
- Harald GossnerIntelVerified email at intel.com
- Rahul PandeyIntel CorporationVerified email at intel.com
- Krishna K. BhuwalkaBelgium Research Center, HuaweiVerified email at huawei.com
- Ashish AgrawalDevcie Engineer at Components Research, Intel CorporationVerified email at intel.com