| Reflow-compatible optical I/O assembly adapter C Zhang, HD Thacker, I Shubin, X Zheng, AV Krishnamoorthy US Patent 10,591,689, 2020 | 29 | 2020 |
| Highly elastic gold passivated mechanically flexible interconnects C Zhang, HS Yang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 27 | 2013 |
| Method for singulating hybrid integrated photonic chips C Zhang, HD Thacker, AV Krishnamoorthy US Patent 9,159,861, 2015 | 24 | 2015 |
| Self-aligned silicon interposer tiles and silicon bridges using positive self-alignment structures and rematable mechanically flexible interconnects HS Yang, C Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 21 | 2014 |
| III-V/Si hybrid laser arrays using back end of the line (BEOL) integration X Zheng, I Shubin, JH Lee, S Lin, Y Luo, J Yao, SS Djordjevic, ... IEEE Journal of Selected Topics in Quantum Electronics 22 (6), 204-217, 2016 | 19 | 2016 |
| Wafer-level packaged optoelectronic module C Zhang, HD Thacker, AV Krishnamoorthy US Patent App. 15/388,186, 2018 | 17 | 2018 |
| Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3-D ICs Y Zhang, Y Zhang, T Sarvey, C Zhang, M Zia, M Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015 | 15 | 2015 |
| Mechanically flexible interconnects (MFIs) with highly scalable pitch C Zhang, HS Yang, MS Bakir Journal of Micromechanics and Microengineering 24 (5), 055024, 2014 | 14 | 2014 |
| Self-alignment structures for heterogeneous 3D integration HS Yang, C Zhang, MS Bakir 2013 IEEE 63rd Electronic Components and Technology Conference, 232-239, 2013 | 11 | 2013 |
| Mechanically flexible interconnects with contact tip for rematable heterogeneous system integration C Zhang, HS Yang, HD Thacker, I Shubin, JE Cunningham, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 10 | 2016 |
| Chip-to-chip interconnect integration technologies M Zia, C Zhang, HS Yang, L Zheng, M Bakir IEICE Electronics Express 13 (6), 20162001-20162001, 2016 | 10 | 2016 |
| Waveguide-last silicon photonic optical connector assembly C Zhang, HD Thacker, X Zheng, AV Krishnamoorthy US Patent 9,933,574, 2018 | 9 | 2018 |
| A self-aligning flip-chip assembly method using sacrificial positive self-alignment structures HS Yang, C Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (3 …, 2016 | 9 | 2016 |
| Gold passivated mechanically flexible interconnects (MFIs) with high elastic deformation C Zhang, HS Yang, MS Bakir 2012 IEEE 62nd Electronic Components and Technology Conference, 245-250, 2012 | 9 | 2012 |
| Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge HS Yang, C Zhang, M Zia, L Zheng, MS Bakir 2014 Optical Interconnects Conference, 71-72, 2014 | 6 | 2014 |
| A microfabricated electronic microplate platform for low-cost repeatable biosensing applications M Zia, T Chi, C Zhang, P Thadesar, T Hookway, J Gonzalez, T McDevitt, ... 2015 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2015 | 5 | 2015 |
| Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection C Zhang, HS Yang, MS Bakir 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 13-19, 2014 | 5 | 2014 |
| A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects C Zhang, HS Yang, MS Bakir Journal of Micromechanics and Microengineering 27 (2), 025014, 2017 | 4 | 2017 |
| Au-NiW mechanically flexible interconnects (MFIs) and TSV integration for 3D interconnects C Zhang, P Thadesar, M Zia, T Sarvey, MS Bakir 2014 International 3D Systems Integration Conference (3DIC), 1-4, 2014 | 4 | 2014 |
| Multi-chip module with self-populating positive features HD Thacker, AV Krishnamoorthy, JE Cunningham, C Zhang US Patent 8,896,112, 2014 | 4 | 2014 |
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