Taigon Song
Taigon Song
knu.ac.kr üzerinde doğrulanmış e-posta adresine sahip - Ana Sayfa
Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
High-frequency scalable electrical model and analysis of a through silicon via (TSV)
J Kim, JS Pak, J Cho, E Song, J Cho, H Kim, T Song, J Lee, H Lee, K Park, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011
4152011
3D-MAPS: 3D Massively Parallel Processor with Stacked Memory
DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ...
IEEE International Solid-State Circuits Conference, 188-190, 2012
2062012
Modeling and analysis of through-silicon via (TSV) noise coupling and suppression using a guard ring
J Cho, E Song, K Yoon, JS Pak, J Kim, W Lee, T Song, K Kim, J Lee, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011
1632011
PDN impedance modeling and analysis of 3D TSV IC by using proposed P/G TSV array model based on separated P/G TSV and chip-PDN models
JS Pak, J Kim, J Cho, K Kim, T Song, S Ahn, J Lee, H Lee, K Park, J Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011
1312011
Low frequency electromagnetic field reduction techniques for the on-line electric vehicle (OLEV)
S Ahn, J Pak, T Song, H Lee, JG Byun, D Kang, CS Choi, E Kim, J Ryu, ...
2010 IEEE International Symposium on Electromagnetic Compatibility, 625-630, 2010
1292010
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
C Liu, T Song, J Cho, J Kim, J Kim, SK Lim
2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC), 783-788, 2011
1052011
Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer
K Yoon, G Kim, W Lee, T Song, J Lee, H Lee, K Park, J Kim
2009 11th Electronics Packaging Technology Conference, 702-706, 2009
842009
Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory)
DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ...
IEEE Transactions on Computers 64 (1), 112-125, 2013
642013
Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs
T Song, C Liu, Y Peng, SK Lim
Proceedings of the 50th Annual Design Automation Conference, 1-7, 2013
442013
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs
T Song, C Liu, DH Kim, SK Lim, J Cho, J Kim, JS Pak, S Ahn, J Kim, ...
2011 12th International Symposium on Quality Electronic Design, 1-7, 2011
362011
On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective
M Jung, T Song, Y Wan, Y Peng, SK Lim
2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC), 1-6, 2014
342014
Silicon effect-aware full-chip extraction and mitigation of TSV-to-TSV coupling
Y Peng, T Song, D Petranovic, SK Lim
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2014
302014
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core
M Jung, T Song, Y Wan, YJ Lee, D Mohapatra, H Wang, G Taylor, ...
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 1-4, 2013
242013
On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs
Y Peng, T Song, D Petranovic, SK Lim
2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 281-288, 2013
232013
Signal integrity analysis and optimization for 3D ICs
C Liu, T Song, SK Lim
2011 12th International Symposium on Quality Electronic Design, 1-8, 2011
212011
Through silicon via (TSV) shielding structures
J Cho, J Kim, T Song, JS Pak, J Kim, H Lee, J Lee, K Park
19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010
202010
Analysis of power distribution network in TSV-based 3D-IC
K Kim, W Lee, J Kim, T Song, J Kim, JS Pak, J Kim, H Lee, Y Kwon, K Park
19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010
182010
I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC
J Kim, J Cho, JS Pak, T Song, J Kim, H Lee, J Lee, K Park
19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010
182010
Full-chip signal integrity analysis and optimization of 3-D ICs
T Song, C Liu, Y Peng, SK Lim
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (5 …, 2015
112015
Design methodologies for low-power 3-D ICs with advanced tier partitioning
M Jung, T Song, Y Peng, SK Lim
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (7 …, 2017
92017
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