| Femtosecond laser micromachining of diamond: Current research status, applications and challenges B Ali, IV Litvinyuk, M Rybachuk Carbon 179, 209-226, 2021 | 61 | 2021 |
| Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5 Cu lead-free solders B Ali, MFM Sabri, I Jauhari, NL Sukiman Microelectronics Reliability 63, 224-230, 2016 | 41 | 2016 |
| Corrosion insight of iron and bismuth added Sn–1Ag–0.5 Cu lead-free solder alloy NWB Subri, M Sarraf, B Nasiri-Tabrizi, B Ali, MF Mohd Sabri, WJ Basirun, ... Corrosion Engineering, Science and Technology 55 (1), 35-47, 2020 | 26 | 2020 |
| Advancement in microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders by optimizing the lanthanum doping concentration B Ali Soldering & Surface Mount Technology 27 (2), 69-75, 2015 | 14 | 2015 |
| Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5 Cu solder alloy under high temperature environment B Ali, MFM Sabri, SM Said, NL Sukiman, I Jauhari, MH Mahdavifard Microelectronics Reliability 82, 171-178, 2018 | 13 | 2018 |
| Microstructural modification of Sn-0.7 Cu solder alloys by Fe/Bi-addition for achieving high mechanical performance B Ali, MFM Sabri, SM Said, MH Mahdavifard, NL Sukiman, I Jauhari Journal of Electronic Materials 46, 4755-4764, 2017 | 9 | 2017 |
| Laser-induced graphitization of diamond under 30 fs laser pulse irradiation B Ali, H Xu, D Chetty, RT Sang, IV Litvinyuk, M Rybachuk The Journal of Physical Chemistry Letters 13 (12), 2679-2685, 2022 | 8 | 2022 |
| Optimised diamond to graphite conversion via a metastable sp1-bonded carbon chain formation under an ultra-short femtosecond (30 fs) laser irradiation B Ali, H Xu, RT Sang, IV Litvinyuk, M Rybachuk Carbon 204, 575-586, 2023 | 6 | 2023 |
| Microhardness and shear performance of Fe/Bi-bearing SAC105 solder alloys under high temperature aging B Ali, MFM Sabri, NL Sukiman, I Jauhari Journal of Materials Science: Materials in Electronics 28, 197-206, 2017 | 5 | 2017 |
| High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5 Cu solder alloys B Ali, MFM Sabri, SM Said, NL Sukiman, I Jauhari, N Soin Journal of Materials Science: Materials in Electronics 28, 7277-7285, 2017 | 4 | 2017 |
| Removal of crystal violet dye from wastewater using low-cost biosorbent Trifolium repens stem powder S Gul, S Afsar, H Gul, B Ali Journal of the Iranian Chemical Society 20 (11), 2781-2792, 2023 | 3 | 2023 |
| Microstructural behavior of iron and bismuth added Sn-1Ag-Cu solder under elevated temperature aging B Ali The 2nd International Conference on Functional Materials and Metallurgy …, 2016 | 2 | 2016 |
| Effect of iron and bismuth addition on the microstructure and mechanical properties of sac105 solder under severe thermal environment/Bakhtiar Ali A Bakhtiar University of Malaya, 2017 | 1 | 2017 |
| Impact of cooling rate on microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders B Ali, S Bilal Journal of Scientific and Innovative Research 3 (6), 588-593, 2014 | 1 | 2014 |
| High-Temperature Lead-free Solder Materials and Applications MFM Sabri, B Ali, SM Said Harsh Environment Electronics: Interconnect Materials and Performance Assessment, 2019 | | 2019 |
| Effect of Iron and Bismuth Addition on the Microstructure and Mechanical Properties of Sac105 Solder Under Severe Thermal Environment B Ali PQDT-Global, 2017 | | 2017 |
| Corrosion Behavior of Sn-1Ag-0.5 Cu Solder Alloy with the Addition of Fe and Bi NW Subri, B Ali, MFM Subri, NL Sukiman Electrochemical Society Meeting Abstracts 230, 1113-1113, 2016 | | 2016 |
