Dynamic Magnetostriction of A Aubert, V Loyau, Y Pascal, F Mazaleyrat, M LoBue
Physical Review Applied 9 (4), 044035, 2018
45 2018 Using laminated metal foam as the top-side contact of a PCB-embedded power die Y Pascal, A Abdedaim, D Labrousse, M Petit, S Lefebvre, F Costa
IEEE Electron Device Letters 38 (10), 1453-1456, 2017
31 2017 Efficiency comparison of inductor-, capacitor-, and resonant-based converters fully integrated in CMOS technology Y Pascal, G Pillonnet
IEEE Journal on Emerging and Selected Topics in Circuits and Systems 5 (3 …, 2015
20 2015 PCB-embedding of power dies using pressed metal foam Y Pascal, D Labrousse, M Petit, S Lefebvre, F Costa
PCIM Europe 2018; International Exhibition and Conference for Power …, 2018
16 2018 Self-tuning multiport resonant DC/DC converter based on actively-controlled inductors for hybrid storage system integration T Pereira, Y Wei, Y Pascal, HA Mantooth, M Liserre
IEEE Transactions on Power Electronics 38 (4), 4787-4804, 2022
12 2022 Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam Y Pascal, D Labrousse, M Petit, S Lefebvre, F Costa
Microelectronics Reliability 88, 707-714, 2018
12 2018 Thermal simulations of SiC MOSFETs under short-circuit conditions: influence of various simulation parameters Y Pascal, M Petit, D Labrousse, F Costa
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), 137-142, 2019
11 2019 Multiwinding transformer leakage inductance optimization for power flow decoupling in multiport dc-dc converters H Beiranvand, F Hoffmann, Y Pascal, F Hahn, M Liserre
2021 IEEE 15th International Conference on Compatibility, Power Electronics …, 2021
10 2021 Study of a topology of low-loss magnetic component for PCB-embedding Y Pascal, M Petit, D Labrousse, F Costa
2018 7th Electronic System-Integration Technology Conference (ESTC), 1-7, 2018
6 2018 Study of the Impedance of the Bypassing Network of a Switching Cell–Influence of the Positioning of the Decoupling Capacitors Y Pascal, D Labrousse, M Petit, F Costa
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), 120-124, 2019
5 2019 Real-Time thermal characterization of power semiconductors using a PSO-based digital twin approach J Kuprat, Y Pascal, M Liserre
2022 24th European Conference on Power Electronics and Applications (EPE'22 …, 2022
4 2022 Multiport Resonant DC-DC Converter using Actively-Controlled Inductors for Hybrid Energy Storage System Integration T Pereira, Y Pascal, M Liserre, Y Wei, HA Mantooth
2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 1154-1161, 2022
4 2022 A behavioral model for short-circuit operation of a GaN-based half bridge S Palazzo, T Pereira, Y Pascal, G Busatto, M Liserre
2023 IEEE Energy Conversion Congress and Exposition (ECCE), 5735-5742, 2023
3 2023 Étude multicritère pour l'enfouissement partiel ou total de convertisseurs d'électronique de puissance dans un circuit imprimé Y Pascal
Université Paris Saclay (COmUE), 2019
3 2019 Voltage Controlled Magnetic Components for Power Electronics M Liserre, Y Pascal, J McCord, T Pereira, R Adelung, L Zimoch, S Kaps, ...
IEEE Power Electronics Magazine 10 (2), 40-48, 2023
2 2023 Condition monitoring of power module using S-parameters, TDR, and TDT Y Pascal, F Daschner, M Liserre, M Höft
Microelectronics Reliability 138, 114615, 2022
2 2022 Analytical model of a resonator for PCB-embedded power conversion Y Pascal, M Petit, D Labrousse, F Costa
Mathematics and Computers in Simulation 184, 106-117, 2021
2 2021 Optical Sensing Applied to Thermal Observers for Enhanced Reliability of Power Modules F Santos-Arana, Y Pascal, J Kuprat, M Langwasser, K Debbadi, M Liserre
2022 IEEE 13th International Symposium on Power Electronics for Distributed …, 2022
1 2022 Technique innovante de contacts sur des puces de puissance enfouies dans du PCB: application à un redresseur de courant Y Pascal, D Labrousse, M Petit, S Lefebvre, F Costa
3ème Symposium de génie électrique (SGE 2018), 2018
1 2018 Online die temperature measurement using S-parameters in GaN-based power converters Y Pascal, F Daschner, S Mönch, M Liserre, M Höft, R Quay
Microelectronics Reliability 150, 115085, 2023
2023 