Nishant Malik
Nishant Malik
smn.uio.no üzerinde doğrulanmış e-posta adresine sahip
Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
AlAl thermocompression bonding for wafer-level MEMS sealing
N Malik, K Schjølberg-Henriksen, E Poppe, MMV Taklo, TG Finstad
Sensors and Actuators A: Physical 211, 115-120, 2014
492014
Impact of SiO2 on Al–Al thermocompression wafer bonding
N Malik, K Schjølberg-Henriksen, EU Poppe, MMV Taklo, TG Finstad
Journal of Micromechanics and Microengineering 25 (3), 035025, 2015
172015
Interfacial characterization of Al-Al thermocompression bonds
N Malik, PA Carvalho, E Poppe, TG Finstad
Journal of Applied Physics 119 (20), 205303, 2016
92016
Environmental stress testing of wafer-level Au-Au thermocompression bonds realized at low temperature: Strength and hermeticity
N Malik, HR Tofteberg, E Poppe, TG Finstad, K Schjølberg-Henriksen
ECS Journal of Solid State Science and Technology 4 (7), P236, 2015
92015
Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding
MS Goorsky, K Schjølberg-Henriksen, B Beekley, T Bai, K Mani, ...
Japanese Journal of Applied Physics 57 (2S1), 02BC03, 2017
82017
Low-temperature aluminum-aluminum wafer bonding
B Rebhan, A Hinterreiter, N Malik, K Schjølberg-Henriksen, V Dragoi, ...
ECS Transactions 75 (9), 15, 2016
72016
Ultraviolet sensing properties of polyvinyl alcohol-coated aluminium-doped zinc oxide nanorods
K Saxena, A Kumar, N Malik, P Kumar, VK Jain
Bulletin of Materials Science 37 (2), 295-300, 2014
52014
Texture of Al films for wafer-level thermocompression bonding
N Malik, V Venkatachalapathy, W Dall, K Schjølberg-Henriksen, E Poppe, ...
Superlattices and Microstructures 106, 216-233, 2017
32017
Environmental stress testing of wafer-level Al-Al thermocompression bonds: strength and hermeticity
N Malik, E Poppe, K Schjølberg-Henriksen, MMV Taklo, TG Finstad
ECS Journal of Solid State Science and Technology 4 (7), P251, 2015
32015
Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding
K Schjølberg-Henriksen, N Malik, A Sandvand, G Kittilsland, ST Moe
ECS Transactions 64 (5), 305, 2014
32014
Low-temperature bonding technologies for MEMS and 3D-IC
MMV Taklo, K Schjølberg-Henriksen, N Malik, HR Tofteberg, E Poppe, ...
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D …, 2014
22014
Al-Al wafer-level thermocompression bonding applied for MEMS
MMV Taklo, K Schjolberg-Henriksen, N Malik, E Poppe, ST Moe, ...
2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017
12017
Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
K Schjølberg-Henriksen, N Malik, EV Gundersen, OR Christiansen, ...
ECS Journal of Solid State Science and Technology 4 (7), P265, 2015
12015
Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
K Schjølberg-Henriksen, N Malik, EV Gundersen, OR Christiansen, ...
ECS Transactions 64 (5), 275, 2014
12014
The Synergistic Roles of Temperature and Pressure in Thermo-Compression Bonding of Au
P Ambhore, K Mani, B Beekley, N Malik, K Schjølberg-Henriksen, S Iyer, ...
ECS Transactions 86 (5), 129, 2018
2018
Benefits of ECS Student Membership
J Locke, A Lupien-Bédard, QC Quebec, N Malik, D Massy, M Metzger, ...
Electrochemical Society Interface, 75, 2014
2014
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Makaleler 1–16