Gang Huang
Gang Huang
Chowbotics Inc
mail.gatech.edu üzerinde doğrulanmış e-posta adresine sahip
Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
Power delivery for 3D chip stacks: Physical modeling and design implication
G Huang, M Bakir, A Naeemi, H Chen, JD Meindl
2007 IEEE Electrical Performance of Electronic Packaging, 205-208, 2007
1552007
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation
MS Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ...
2008 IEEE Custom Integrated Circuits Conference, 663-670, 2008
1252008
3-D ICs equipped with double sided power, coolant, and data features
MS Bakir, G Huang
US Patent 8,546,930, 2013
612013
Co-design of signal, power, and thermal distribution networks for 3D ICs
YJ Lee, YJ Kim, G Huang, M Bakir, Y Joshi, A Fedorov, SK Lim
2009 Design, Automation & Test in Europe Conference & Exhibition, 610-615, 2009
452009
Compact physical models for power supply noise and chip/package co-design of gigascale integration
G Huang, DC Sekar, A Naeemi, K Shakeri, JD Meindl
2007 Proceedings 57th Electronic Components and Technology Conference, 1659-1666, 2007
322007
Power delivery for 3-D chip stacks: Physical modeling and design implication
G Huang, MS Bakir, A Naeemi, JD Meindl
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (5 …, 2012
302012
Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs
L Zheng, Y Zhang, G Huang, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014
282014
Performance modeling for carbon nanotube interconnects in on-chip power distribution
A Naeemi, G Huang, JD Meindl
2007 Proceedings 57th Electronic Components and Technology Conference, 420-428, 2007
212007
Physical model for power supply noise and chip/package co-Design in gigascale systems with the consideration of hot spots
G Huang, D Sekar, A Naeemi, K Shakeri, JD Meindl
2007 IEEE Custom Integrated Circuits Conference, 841-844, 2007
142007
3D integrated circuits: liquid cooling and power delivery
MS Bakir, G Huang, D Sekar, C King
IETE Technical review 26 (6), 407-416, 2009
122009
Compact physical models for chip and package power and ground distribution networks for gigascale integration (GSI)
G Huang, A Naeemi, T Zhou, D O'Connor, A Muszynski, B Singh, ...
2008 58th Electronic Components and Technology Conference, 646-651, 2008
112008
Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems
G Huang
Georgia Institute of Technology, 2008
62008
Minimizing energy-per-bit for on-board LC transmission lines
G Huang, A Naeemi, JD Meindl
Proceedings of the IEEE 2005 International Interconnect Technology …, 2005
52005
Power delivery, signaling and cooling for 2D and 3D integrated systems
M Bakir, G Huang, B Dang
Coupled Data Communication Techniques for High-Performance and Low-Power …, 2010
42010
Ultracompact and high-performance 3-D integrated heterogeneous systems using microliquid cooling
M Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ...
Proc. IEEE Custom Integr. Circuits Conf., 663-670, 2008
22008
3-D ICS Equipped With Double Sided Power, Coolant, And Data Features
MS Bakir, G Huang
12013
An approach to predicting dynamic power dissipation of coupled interconnect network in dynamic CMOS logic circuits
G Huang, H Yang, R Luo, H Wang
Science in China Series F: Information Sciences 45 (4), 286-298, 2002
2002
Sistem, işlemi şu anda gerçekleştiremiyor. Daha sonra yeniden deneyin.
Makaleler 1–17