Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling H Chen, M Mueller, TT Mattila, J Li, X Liu, KJ Wolter, M Paulasto-Kröckel
Journal of Materials Research 26 (16), 2103-2116, 2011
68 2011 Miniaturized double side cooling packaging for high power 3 phase SiC inverter module with junction temperature over 220° C DRM Woo, HH Yuan, JAJ Li, LJ Bum, Z Hengyun
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1190-1196, 2016
39 2016 High power SiC inverter module packaging solutions for junction temperature over 220°C RPS Woo, Daniel Rhee Min Zhang Hengyun, Susai Lawrence Selvaraj, Sorono ...
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
39 * 2014 Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications VS Rao, SC Chong, C Zhaohui, JL Aw, EWL Ching, H Gilho, ...
Electronics Packaging Technology Conference (EPTC 2013), 543-548, 2013
36 * 2013 The effects of concurrent power and vibration loads on the reliability of board-level interconnections in power electronic assemblies JS Karppinen, J Li, M Paulasto-Krockel
IEEE Transactions on Device and Materials Reliability 13 (1), 167-176, 2012
29 2012 Challenges of ultra-thin 5 sides molded WLCSP T Tang, A Lan, J Wu, J Huang, J Tsai, J Li, A Ho, J Chang, WH Lin
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1167-1171, 2016
24 2016 Microstructural evolution and mechanical properties of Au-20wt.% Sn| Ni interconnection HQ Dong, V Vuorinen, XW Liu, T Laurila, J Li, M Paulasto-Kröckel
Journal of Electronic Materials 45, 566-575, 2016
18 2016 Reliability assessment of a MEMS microphone under shock impact loading J Li, J Makkonen, M Broas, J Hokka, TT Mattila, M Paulasto-Kröckel, ...
2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013
17 2013 Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/low-K chip KY Au, FX Che, JL Aw, JK Lin, B Boehme, F Kuechenmeister
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 574-578, 2014
16 2014 Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad KY Au, FX Che, JK Lin, HY Hsiao, X Zhang, S Lim, JL Aw, A Chow
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 936-942, 2016
15 2016 Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment JS Karppinen, J Li, TT Mattila, M Paulasto-Kröckel
Microelectronics Reliability 50 (12), 1994-2000, 2010
15 2010 Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking L Xie, S Wickramanayaka, BY Jung, JAJ Li, L Jung-kai, D Ismael
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
13 2014 Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics FL Lau, RI Made, WN Putra, JZ Lim, VC Nachiappan, JL Aw, CL Gan
Microelectronics Reliability 53 (9-11), 1581-1586, 2013
11 2013 Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading T Laurila, J Karppinen, V Vuorinen, J Li, A Paul, M Paulasto-Kröckel
Journal of electronic materials 41, 3179-3195, 2012
11 2012 Methods for reliability assessment of MEMS devices—Case studies of a MEMS microphone and a 3-axis MEMS gyroscope J Hokka, J Raami, H Hyvönen, M Broas, J Makkonen, J Li, TT Mattila, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 62-69, 2012
10 2012 Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process SC Chong, JL Aw, EWL Ching, DI Cereno, HY Li, SR Vempati, KH Teo
Electronics Packaging Technology Conference (EPTC 2013), 250-254, 2013
9 * 2013 Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies LJ Bum, JAJ Li, DRM Woo
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 318-321, 2014
8 2014 Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking L Xie, S Wickramanayaka, H Li, BY Jung, JL Aw, SC Chong
Electronics Packaging Technology Conference (EPTC 2013), 493-497, 2013
8 2013 3-D TSV Six-Die Stacking and Reliability Assessment of 20- m-Pitch Bumps on Large-Scale Dies JB Lee, JL Aw, MW Rhee
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (1 …, 2016
7 2016 Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading T Laurila, J Karppinen, J Li, V Vuorinen, M Paulasto-Kröckel
Journal of Materials Science: Materials in Electronics 24, 644-653, 2013
7 2013