Maaike Margrete Visser Taklo
Maaike Margrete Visser Taklo
Research Manager, SINTEF
sintef.no üzerinde doğrulanmış e-posta adresine sahip
Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
Handbook of wafer bonding
P Ramm, JJQ Lu, MMV Taklo
John Wiley & Sons, 2011
1272011
Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold
MMV Taklo, P Storås, K Schjølberg-Henriksen, HK Hasting, H Jakobsen
Journal of Micromechanics and Microengineering 14 (7), 884, 2004
1042004
3D integration technology: Status and application development
P Ramm, A Klumpp, J Weber, N Lietaer, M Taklo, W De Raedt, T Fritzsch, ...
2010 Proceedings of ESSCIRC, 9-16, 2010
922010
Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring
A Vogl, DT Wang, P Storås, T Bakke, MMV Taklo, A Thomson, L Balgård
Sensors and actuators a: physical 153 (2), 155-161, 2009
722009
3D System-on-Chip technologies for More than Moore systems
P Ramm, A Klumpp, J Weber, MMV Taklo
Microsystem technologies 16 (7), 1051-1055, 2010
632010
AlAl thermocompression bonding for wafer-level MEMS sealing
N Malik, K Schjølberg-Henriksen, E Poppe, MMV Taklo, TG Finstad
Sensors and Actuators A: Physical 211, 115-120, 2014
472014
Au-Sn SLID bonding: A reliable HT interconnect and die attach technology
TA Tollefsen, A Larsson, MMV Taklo, A Neels, X Maeder, K Høydalsvik, ...
Metallurgical and Materials Transactions B 44 (2), 406-413, 2013
422013
Characterization and failure analysis of 3D integrated systems using a novel plasma‐FIB system
L Kwakman, G Franz, MMV Taklo, A Klumpp, P Ramm
AIP Conference Proceedings 1395 (1), 269-273, 2011
392011
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
J Zürcher, K Yu, G Schlottig, M Baum, MMV Taklo, B Wunderle, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1115-1121, 2015
362015
Wafer-level solid-liquid interdiffusion bonding
N Hoivik, K Aasmundtveit, P Ramm, JJQ Lu, MMV Taklo
Handbook of wafer bonding 181, 2012
332012
Anodic bonding of glass to aluminium
K Schjølberg-Henriksen, E Poppe, S Moe, P Storås, MMV Taklo, DT Wang, ...
Microsystem technologies 12 (5), 441, 2006
312006
Use of conductive adhesive for MEMS interconnection in ammunition fuze applications
J Gakkestad, P Dalsjo, H Kristiansen, R Johannessen, MMV Taklo
Journal of Micro/Nanolithography, MEMS, and MOEMS 9 (4), 041108, 2010
252010
All-copper flip chip interconnects by pressureless and low temperature nanoparticle sintering
J Zürcher, L Del Carro, G Schlottig, DN Wright, ASB Vardøy, MMV Taklo, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 343-349, 2016
242016
Bonding and TSV in 3D IC integration: physical analysis with plasma FIB
MM Taklo, A Klumpp, P Ramm, L Kwakman, G Franz
Microsc. Anal 114, 9-12, 2011
242011
Wafer-level Au–Au bonding in the 350–450° C temperature range
HR Tofteberg, K Schjølberg-Henriksen, EJ Fasting, AS Moen, MMV Taklo, ...
Journal of Micromechanics and Microengineering 24 (8), 084002, 2014
202014
Low-temperature plasma activated bonding for a variable optical attenuator
K Schjølberg-Henriksen, S Moe, MMV Taklo, P Storås, JH Ulvensøen
Sensors and Actuators A: Physical 142 (1), 413-420, 2008
182008
Impact of SiO2 on Al–Al thermocompression wafer bonding
N Malik, K Schjølberg-Henriksen, EU Poppe, MMV Taklo, TG Finstad
Journal of Micromechanics and Microengineering 25 (3), 035025, 2015
172015
Oxide charges induced by plasma activation for wafer bonding
K Schjølberg-Henriksen, MMV Taklo, A Hanneborg, GU Jensen
Sensors and Actuators A: Physical 102 (1-2), 99-105, 2002
172002
Reliable HT electronic packaging—Optimization of a Au-Sn slid joint
TA Tollefsen, MMV Taklo, KE Aasmundtveit, A Larsson
2012 4th Electronic System-Integration Technology Conference, 1-6, 2012
142012
Characterization of hermetic wafer-level Cu-Sn SLID bonding
HJ Van de Wiel, ASB Vardøy, G Hayes, HR Fischer, A Lapadatu, ...
2012 4th Electronic System-Integration Technology Conference, 1-7, 2012
142012
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