Packaging of bio-MEMS: Strategies, technologies, and applications T Velten, HH Ruf, D Barrow, N Aspragathos, P Lazarou, E Jung, CK Malek, ... IEEE Transactions on Advanced Packaging 28 (4), 533-546, 2005 | 121 | 2005 |
Reliability assessment of flip-chip assemblies with lead-free solder joints A Schubert, R Dudek, H Walter, E Jung, A Gollhardt, B Michel, H Reichl 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 100 | 2002 |
3-D capacitive interconnections with mono-and bi-directional capabilities A Fazzi, R Canegallo, L Ciccarelli, L Magagni, F Natali, E Jung, P Rolandi, ... IEEE Journal of Solid-State Circuits 43 (1), 275-284, 2008 | 71 | 2008 |
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology J Kloeser, K Heinricht, K Kutzner, E Jung, A Ostmann, H Reichl IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 65 | 1998 |
Method for transfering solder to a device and/or testing the device K Kaskoun, E Jung, W Budweiser US Patent 6,409,073, 2002 | 64 | 2002 |
Reliability issues in Pb-free solder joint miniaturization Z Huang, PP Conway, E Jung, RC Thomson, C Liu, T Loeher, M Minkus Journal of electronic materials 35, 1761-1772, 2006 | 59 | 2006 |
Method for producing encapsulated chips KF Becker, T Braun, M Koch, A Ostmann, L Böttcher, E Jung US Patent 7,011,989, 2006 | 57 | 2006 |
On-chip automation of cell-free protein synthesis: new opportunities due to a novel reaction mode V Georgi, L Georgi, M Blechert, M Bergmeister, M Zwanzig, ... Lab on a Chip 16 (2), 269-281, 2016 | 55 | 2016 |
Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array A Sharma, L Rieth, P Tathireddy, R Harrison, H Oppermann, M Klein, ... Journal of neural engineering 8 (4), 045004, 2011 | 55 | 2011 |
3D capacitive interconnections with mono-and bi-directional capabilities A Fazzi, R Canegallo, L Ciccarelli, L Magagni, F Natali, E Jung, ... 2007 IEEE International Solid-State Circuits Conference. Digest of Technical …, 2007 | 53 | 2007 |
3-D capacitive interconnections for wafer-level and die-level assembly A Fazzi, L Magagni, M Mirandola, B Charlet, L Di Cioccio, E Jung, ... IEEE Journal of Solid-State Circuits 42 (10), 2270-2282, 2007 | 50 | 2007 |
Realization of a stackable package using chip in polymer technology A Ostmann, A Neumann, S Weser, E Jung, L Bottcher, H Reichl 2nd International IEEE Conference on Polymers and Adhesives in …, 2002 | 48 | 2002 |
Stackable system-on-packages with integrated components KF Becker, E Jung, A Ostmann, T Braun, A Neumann, R Aschenbrenner, ... IEEE Transactions on Advanced Packaging 27 (2), 268-277, 2004 | 45 | 2004 |
Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term … A Sharma, L Rieth, P Tathireddy, R Harrison, H Oppermann, M Klein, ... Sensors and Actuators A: Physical 188, 167-172, 2012 | 40 | 2012 |
Low cost bumping by stencil printing: process qualification for 200 μm pitch J Kloeser, K Heinricht, E Jung, L Lauter, A Ostmann, R Aschenbrenner, ... Microelectronics Reliability 40 (3), 497-505, 2000 | 40 | 2000 |
Ultra thin chips for miniaturized products E Jung, A Ostmann, D Wojakowski, C Landesberger, R Aschenbrenner, ... Microsystem technologies 9, 449-452, 2003 | 39 | 2003 |
A new approach to chip size package using meniscus soldering and FPC-bonding C Kallmayer, E Jung, P Kasulke, R Azadeh, G Azdasht, E Zakel, H Reichl IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 31 | 1998 |
State-of-the-art of 3D SiP Technology T Thomas, FY Lin, KF Becker, T Braun, E Jung, R Aschenbrenner, ... Proceedings of IMAPS Poland 2, 2009 | 26 | 2009 |
Packaging options for MEMS devices E Jung MRS bulletin 28 (1), 51-54, 2003 | 26 | 2003 |
The biocompatibility of materials used in printed circuit board technologies with respect to primary neuronal and K562 cells M Mazzuferi, R Bovolenta, M Bocchi, T Braun, J Bauer, E Jung, B Iafelice, ... Biomaterials 31 (6), 1045-1054, 2010 | 22 | 2010 |