| Roughness characterization for interconnect analysis Y Shlepnev, C Nwachukwu 2011 IEEE International Symposium on Electromagnetic Compatibility, 518-523, 2011 | 37 | 2011 |
| Which one is better? Comparing options to describe frequency dependent losses E Bogatin, D DeGroot, PG Huray, Y Shlepnev | 34 | 2013 |
| Measurement-assisted electromagnetic extraction of interconnect parameters on low-cost FR-4 boards for 6-20 Gb/sec applications Y Shlepnev, A Neves, T Dagostino, S McMorrow Proc. DesignCon 2009, 1-28, 2009 | 31 | 2009 |
| Trefftz finite elements for electromagnetics YO Shlepnev IEEE Transactions on Microwave Theory and Techniques 50 (5), 1328-1339, 2002 | 27 | 2002 |
| Nickel characterization for interconnect analysis Y Shlepnev, S McMorrow 2011 IEEE International Symposium on Electromagnetic Compatibility, 524-529, 2011 | 26 | 2011 |
| Unified approach to interconnect conductor surface roughness modelling Y Shlepnev 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging …, 2017 | 24 | 2017 |
| Practical methodology for analyzing the effect of conductor roughness on signal losses and dispersion in interconnects Y Shlepnev, C Nwachukwu Proc. DesignCon 4, 2931-2955, 2012 | 24 | 2012 |
| Modelling jitter induced by fibre weave effect in PCB dielectrics Y Shlepnev, C Nwachukwu 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014 | 21 | 2014 |
| Practical identification of dispersive dielectric models with generalized modal S-parameters for analysis of interconnects in 6-100 Gb/s applications Y Shlepnev, A Neves, T Dagostino, S McMorrow Proc. of DesignCon, 2010 | 21 | 2010 |
| Modeling frequency-dependent conductor losses and dispersion in serial data channel interconnects Y Shlepnev Simberian Inc, 1-12, 2007 | 14 | 2007 |
| Decompositional electromagnetic analysis of digital interconnects Y Shlepnev 2013 IEEE International Symposium on Electromagnetic Compatibility, 563-568, 2013 | 13 | 2013 |
| System and method for identification of complex permittivity of transmission line dielectric Y Shlepnev US Patent 8,577,632, 2013 | 12 | 2013 |
| Broadband material model identification with GMS-parameters Y Shlepnev 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems …, 2015 | 11 | 2015 |
| Lessons learned: How to make predictable PCB interconnects for data rates of 50 Gbps and beyond W Beyene, YC Hahm, J Ren, D Secker, D Mullen, Y Shlepnev Proc. DesignCon, 2036-2057, 2014 | 11 | 2014 |
| Quality metrics for S-parameter models Y Shlepnev DesignCon IBIS Summit, 2010 | 10 | 2010 |
| Sink or swim at 28 Gbps Y Shlepnev The PCB Design Magazine 3 (10), 12-23, 2014 | 9 | 2014 |
| System and method for identification of conductor surface roughness model for transmission lines Y Shlepnev US Patent App. 14/045,392, 2014 | 9 | 2014 |
| Design and optimization of a novel 2.4 mm coaxial field replaceable connector suitable for 25 Gbps system and material characterization up to 50 GHz D Dunham, J Lee, S McMorrow, Y Shlepnev DesignCon. Santa Clara, CA, USA, 1-29, 2011 | 9 | 2011 |
| Design, modeling, and characterization of passive channels for data rates of 50 Gbps and beyond W Beyene, YC Hahm, D Secker, D Mullen, Y Shlepnev 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 730-735, 2014 | 8 | 2014 |
| Systematic approach to PCB interconnects analysis to measurement validation M Marin, Y Shlepnev 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 6 | 2018 |
