Tony Wu
Tony Wu
Verified email at stanford.edu
Title
Cited by
Cited by
Year
Energy-efficient abundant-data computing: The N3XT 1,000 x
MMS Aly, M Gao, G Hills, CS Lee, G Pitner, MM Shulaker, TF Wu, ...
Computer 48 (12), 24-33, 2015
1472015
Monolithic 3D integration of logic and memory: Carbon nanotube FETs, resistive RAM, and silicon FETs
MM Shulaker, TF Wu, A Pal, L Zhao, Y Nishi, K Saraswat, HSP Wong, ...
2014 IEEE International Electron Devices Meeting, 27.4. 1-27.4. 4, 2014
1142014
Carbon nanotube circuit integration up to sub-20 nm channel lengths
MM Shulaker, J Van Rethy, TF Wu, L Suriyasena Liyanage, H Wei, Z Li, ...
ACS nano 8 (4), 3434-3443, 2014
742014
TPAD: Hardware Trojan prevention and detection for trusted integrated circuits
TF Wu, K Ganesan, YA Hu, HSP Wong, S Wong, S Mitra
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015
722015
Hyperdimensional computing with 3D VRRAM in-memory kernels: Device-architecture co-design for energy-efficient, error-resilient language recognition
H Li, TF Wu, A Rahimi, KS Li, M Rusch, CH Lin, JL Hsu, MM Sabry, ...
2016 IEEE International Electron Devices Meeting (IEDM), 16.1. 1-16.1. 4, 2016
552016
Brain-inspired computing exploiting carbon nanotube FETs and resistive RAM: Hyperdimensional computing case study
TF Wu, H Li, PC Huang, A Rahimi, JM Rabaey, HSP Wong, MM Shulaker, ...
2018 IEEE International Solid-State Circuits Conference-(ISSCC), 492-494, 2018
522018
Resistive RAM-centric computing: Design and modeling methodology
H Li, TF Wu, S Mitra, HSP Wong
IEEE Transactions on Circuits and Systems I: Regular Papers 64 (9), 2263-2273, 2017
472017
Monolithic 3D integration: A path from concept to reality
MM Shulaker, TF Wu, MM Sabry, H Wei, HSP Wong, S Mitra
2015 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2015
342015
Cooling three-dimensional integrated circuits using power delivery networks
H Wei, TF Wu, D Sekar, B Cronquist, RF Pease, S Mitra
2012 International Electron Devices Meeting, 14.2. 1-14.2. 4, 2012
342012
Efficient metallic carbon nanotube removal for highly-scaled technologies
MM Shulaker, G Hills, TF Wu, Z Bao, HSP Wong, S Mitra
2015 IEEE International Electron Devices Meeting (IEDM), 32.4. 1-32.4. 4, 2015
302015
The N3XT Approach to Energy-Efficient Abundant-Data Computing
MMS Aly, TF Wu, A Bartolo, YH Malviya, W Hwang, G Hills, I Markov, ...
Proceedings of the IEEE 107 (1), 19-48, 2018
292018
Hyperdimensional computing exploiting carbon nanotube FETs, resistive RAM, and their monolithic 3D integration
TF Wu, H Li, PC Huang, A Rahimi, G Hills, B Hodson, W Hwang, ...
IEEE Journal of Solid-State Circuits 53 (11), 3183-3196, 2018
202018
Monolithic 3D integration advances and challenges: From technology to system levels
MS Ebrahimi, G Hills, MM Sabry, MM Shulaker, H Wei, TF Wu, S Mitra, ...
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S …, 2014
192014
Resistive RAM With Multiple Bits Per Cell: Array-Level Demonstration of 3 Bits Per Cell
BQ Le, A Grossi, E Vianello, T Wu, G Lama, E Beigne, HSP Wong, S Mitra
IEEE Transactions on Electron Devices 66 (1), 641-646, 2018
172018
Resistive RAM endurance: Array-level characterization and correction techniques targeting deep learning applications
A Grossi, E Vianello, MM Sabry, M Barlas, L Grenouillet, J Coignus, ...
IEEE Transactions on Electron Devices 66 (3), 1281-1288, 2019
162019
3D nanosystems enable embedded abundant-data computing: special session paper
W Hwang, MMS Aly, YH Malviya, M Gao, TF Wu, C Kozyrakis, HSP Wong, ...
Proceedings of the Twelfth IEEE/ACM/IFIP International Conference on …, 2017
11*2017
Nano-engineered architectures for ultra-low power wireless body sensor nodes
R Braojos, D Atienza, MMS Aly, TF Wu, HSP Wong, S Mitra, G Ansaloni
Proceedings of the Eleventh IEEE/ACM/IFIP International Conference on …, 2016
112016
14.3 A 43pJ/Cycle non-volatile microcontroller with 4.7 μs shutdown/wake-up integrating 2.3-bit/cell resistive RAM and resilience techniques
TF Wu, BQ Le, R Radway, A Bartolo, W Hwang, S Jeong, H Li, P Tandon, ...
2019 IEEE International Solid-State Circuits Conference-(ISSCC), 226-228, 2019
62019
Device-architecture co-design for hyperdimensional computing with 3D vertical resistive switching random access memory (3D VRRAM)
H Li, TF Wu, S Mitra, HSP Wong
2017 International Symposium on VLSI Technology, Systems and Application …, 2017
52017
Hyperdimensional computing nanosystem
A Rahimi, TF Wu, H Li, JM Rabaey, HSP Wong, MM Shulaker, S Mitra
arXiv preprint arXiv:1811.09557, 2018
42018
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