| Effects of geometry and composition of soft polymer films embedded with nanoparticles on rates for optothermal heat dissipation DK Roper, KR Berry, JR Dunklin, C Chambers, V Bejugam, GT Forcherio, ... Nanoscale 10 (24), 11531-11543, 2018 | 11 | 2018 |
| Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages M Fettke, T Kubsch, A Kolbasow, V Bejugam, A Frick, T Teutsch 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1016-1024, 2020 | 9 | 2020 |
| A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs M Fettke, A Kolbasow, V Bejugam, T Kubsch, A Frick, T Teutsch, YC Wang, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1928-1934, 2020 | 7 | 2020 |
| Controlled gold nanoparticle placement into patterned polydimethylsiloxane thin films via directed self-assembly KR Berry, RL Romo, M Mitchell, V Bejugam, DK Roper Journal of Nanomaterials 2019, 2019 | 4 | 2019 |
| Opto-thermal characterization of plasmon and coupled lattice resonances in 2-D metamaterial arrays V Bejugam University of Arkansas, 2018 | 4 | 2018 |
| Reductive spectrophotometry of divalent tin sensitization on soda lime glass V Bejugam, X Wei, DK Roper Applied Surface Science 376, 43-51, 2016 | 3 | 2016 |
| Laser assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures M Fettke, R Baba, T Kubsch, G Friedrich, R Thalmann, V Bejugam, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 462-469, 2021 | 2 | 2021 |
| SB²-WB: A new process solution for advanced wire-bonding M Fettke, A Kolbasow, G Friedrich, A Palys, V Bejugam, T Teutsch 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 47-54, 2019 | 2 | 2019 |
| A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding M Fettke, T Kubsch, A Frick, V Bejugam, G Friedrich, T Teutsch 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2089-2096, 2021 | 1 | 2021 |
| Study of solder interconnect configurations and performance of vertical laser assisted assembled “3.5 D” packages A Kolbasow, M Fettke, T Kubsch, V Bejugam, T Teutsch 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1936-1942, 2020 | 1 | 2020 |
| Singulation of integrated circuit package substrates with glass cores S Hanyu, V Bejugam, Y Li, G Duan, A Garelick US Patent App. 17/957,355, 2024 | | 2024 |
| Ic package with micro leds J Vehonsky, O Ozkan, V Bejugam, M Tseng, N Haehn, AN FLORES, ... US Patent App. 17/903,126, 2024 | | 2024 |
| Dual sided glass carriers for making package substrates J Vehonsky, O Ozkan, V Bejugam, M Tseng, A Nicolas, N Haehn US Patent App. 17/901,894, 2024 | | 2024 |
| DESIGN OPTIMIZATION FOR RASTER SCANNING US Patent App. 17/738,085, 2023 | | 2023 |
| Method for electrolessly depositing a metal layer onto a substrate V Bejugam, T Teutsch US Patent App. 18/024,550, 2023 | | 2023 |
| Method and apparatus for removing laser debond residue from substrate J Ecton, V Bejugam, J Kaplan, Y Li, W Bryks, S George, J Cross US Patent App. 17/698,024, 2023 | | 2023 |
| METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE JC Jeremy ECTON, Vinith BEJUGAM, Jefferson KAPLAN, Yonggang LI, Whitney ... US Patent 20,230,294,204, 2023 | | 2023 |
| Verfahren zum stromlosen Aufbringen einer Metallschicht auf ein Substrat V Bejugam, T Teutsch DE Patent 102020123633A1, 2022 | | 2022 |
| A Study About Facile Interconnect Formations Involving SB2-JET Solder Ball Stacking and Colonnade Patterning in Hybrid Package Architectures M Fettke, T Kubsch, V Bejugam, A Frick, A Kolbasow, S Walter, T Teutsch 2020 International Wafer Level Packaging Conference (IWLPC), 1-8, 2020 | | 2020 |
| Ralph E. Martin Department of Chemical Engineering, University of Arkansas, Fayetteville, AR 72701, USA KR Berry Jr, RL Romo, M Mitchell, V Bejugam, DK Roper Self-Assembled Nanoantenna Enhance Optical Activity and Transport in …, 2019 | | 2019 |
D. Keith RoperProfessor and Department Head, Utah State UniversityVerified email at usu.edu
