Dr. Gokul Kumar
Dr. Gokul Kumar
Georgia Institute of Technology
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Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
3D-MAPS: 3D massively parallel processor with stacked memory
SK Lim
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits …, 2013
2052013
Design, fabrication, and characterization of ultrathin 3-D glass interposers with through-package-vias at same pitch as TSVs in silicon
V Sukumaran, G Kumar, K Ramachandran, Y Suzuki, K Demir, Y Sato, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014
902014
Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory)
DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ...
IEEE Transactions on Computers 64 (1), 112-125, 2013
632013
Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications
G Kumar, T Bandyopadhyay, V Sukumaran, V Sundaram, SK Lim, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 217-223, 2011
562011
Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC
V Sundaram, Q Chen, Y Suzuki, G Kumar, F Liu, R Tummala
2012 IEEE 62nd Electronic Components and Technology Conference, 292-297, 2012
422012
Modeling, fabrication, and characterization of low-cost and high-performance polycrystalline panel-based silicon interposer with through vias and redistribution layers
Q Chen, Y Suzuki, G Kumar, V Sundaram, RR Tummala
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014
222014
Design and demonstration of power delivery networks with effective resonance suppression in double-sided 3-D glass interposer packages
G Kumar, S Sitaraman, J Cho, V Sundaram, J Kim, RR Tummala
IEEE Transactions on components, packaging and manufacturing technology 6 (1 …, 2015
162015
Aggressively voltage overscaled adaptive RF systems using error control at the bit and symbol levels
J Natarajan, G Kumar, S Sen, MM Nisar, D Lee, A Chatterjee
2009 15th IEEE International On-Line Testing Symposium, 249-254, 2009
92009
Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers
G Kumar, PM Raj, J Cho, S Gandhi, P Chakraborti, V Sundaram, J Kim, ...
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 541-547, 2014
82014
Power delivery network analysis of 3D double-side glass interposers for high bandwidth applications
G Kumar, S Sitaraman, J Cho, SJ Kim, V Sundaram, J Kim, R Tummala
2013 IEEE 63rd Electronic Components and Technology Conference, 1100-1108, 2013
82013
Modeling and design of an ultra-miniaturized WLAN sub-system with chip-last embedded PA and digital dies
G Kumar, S Sitaraman, V Sridharan, N Sankaran, F Liu, N Kumbhat, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 1015-1022, 2012
42012
Modeling, design, fabrication and characterization of power delivery networks and resonance suppression in double-sided 3-D glass interposer packages
G Kumar
Georgia Institute of Technology, 2015
22015
3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSV
R Tummala
Additional Papers and Presentations 2012 (DPC), 000757-000790, 2012
12012
Solar PV Application in Industrial Conveyor System
PP Raj, NR Pochont, KMVR Teja, GD Kumar
IOP Conference Series: Earth and Environmental Science 573 (1), 012046, 2020
2020
EMI modeling and correlation in a highly integrated package design
S Mobin, G Kumar, DN de Araujo, S McKinney
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016
2016
IMPACT OF ZINC SULPHATE HEPTAHYDRATE ON THE BEHAVIOUR OF COIR POWDER BASED REINFORCED POLYESTER COMPOSITES
KMVR TEJA, NR POCHONT, PP RAJ, GD KUMAR
LOW-COST AND HIGH PERFORMANCE SILICON INTERPOSERS AND PACKAGES (LSIP)–A NEW GEORGIA TECH PRC INDUSTRY CONSORTIUM
RR Tummala, V Sundaram, Q Chen, H Lu, G Kumar
Sistem, işlemi şu anda gerçekleştiremiyor. Daha sonra yeniden deneyin.
Makaleler 1–17