| Influence of liquid height on bubble coalescence, vapor venting, liquid return, and heat transfer in pool boiling MY Shukla, SG Kandlikar International Journal of Heat and Mass Transfer 173, 121261, 2021 | 21 | 2021 |
| Evaluation of heater size and external enhancement techniques in pool boiling heat transfer with dielectric fluids F Mody, A Chauhan, M Shukla, SG Kandlikar International Journal of Heat and Mass Transfer 183, 122176, 2022 | 11 | 2022 |
| Experimental study of heat transfer in a microchannel with pin fins and sintered coatings M Bulut, M Shukla, SG Kandlikar, N Sozbir Experimental Heat Transfer 36 (7), 1099-1114, 2023 | 8 | 2023 |
| Numerical Simulation for Analyzing Interfacial Velocity and Interfacial Forces of a Bubble Motion in Taper Micro Gap D Pal, M Shukla, I Perez-Raya, S Kandlikar ASME International Mechanical Engineering Congress and Exposition 86700 …, 2022 | 2 | 2022 |
| Experimental Investigation of Taper Angle and Airflow Rate on Air-Injected Bubble Squeezing in a Tapered Microgap MY Shukla, SG Kandlikar ASME International Mechanical Engineering Congress and Exposition 86700 …, 2022 | 2 | 2022 |
| Investigating the effect of the fluid properties on bubble dynamics and heat transfer in a tapered microgap with multiphase flow modeling D Pal, MY Shukla, SG Kandlikar, I Perez-Raya Applied Thermal Engineering 236, 121825, 2024 | 1 | 2024 |
| Influence of Liquid Height on Pool Boiling Heat Transfer MY Shukla Rochester Institute of Technology, 2020 | 1 | 2020 |
| A hypersensitive pressure sensor array for phase change microfluidics analysis CJ Biancone, TJ Huang, MY Shukla, SG Kandlikar, I Puchades Sensors and Actuators A: Physical 372, 115344, 2024 | | 2024 |
| Enhancement Evaluation Criteria for Pool Boiling Enhancement Structures in Electronics Cooling: CHF Enhancement Ratio (ER-CHF) and Enhancement Index (EI) MY Shukla, SG Kandlikar Journal of Enhanced Heat Transfer 31, 2024 | | 2024 |
| Cooling device having a boiling chamber with submerged condensation and method SG Kandlikar, M Shukla US Patent App. 17/981,256, 2023 | | 2023 |
Kandlikar SGMechanical Engineering, Rochester Institute of Technologyrit.edu üzerinde doğrulanmış e-posta adresine sahip
