Yuanqing Cheng
Yuanqing Cheng
Assistant Professor of Electrical Engineering, Beihang University
Verified email at ieee.org - Homepage
Title
Cited by
Cited by
Year
Thermal-constrained task allocation for interconnect energy reduction in 3-D homogeneous MPSoCs
Y Cheng, L Zhang, Y Han, X Li
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 21 (2), 239-249, 2012
682012
Compact model of subvolume MTJ and its design application at nanoscale technology nodes
Y Zhang, B Yan, W Kang, Y Cheng, JO Klein, Y Zhang, Y Chen, W Zhao
IEEE Transactions on Electron Devices 62 (6), 2048-2055, 2015
662015
A radiation hardened hybrid spintronic/CMOS nonvolatile unit using magnetic tunnel junctions
W Zhao, E Deng, JO Klein, Y Cheng, D Ravelosona, Y Zhang, C Chappert
Journal of Physics D: Applied Physics 47 (40), 405003, 2014
522014
Architecture design with STT-RAM: Opportunities and challenges
P Chi, S Li, Y Cheng, Y Lu, SH Kang, Y Xie
2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 109-114, 2016
342016
Radiation-induced soft error analysis of STT-MRAM: A device to circuit approach
J Yang, P Wang, Y Zhang, Y Cheng, W Zhao, Y Chen, HH Li
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015
312015
Temperature impact analysis and access reliability enhancement for 1T1MTJ STT-RAM
B Wu, Y Cheng, J Yang, A Todri-Sanial, W Zhao
IEEE Transactions on Reliability 65 (4), 1755-1768, 2016
252016
Building energy-efficient multi-level cell STT-RAM caches with data compression
L Liu, P Chi, S Li, Y Cheng, Y Xie
2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC), 751-756, 2017
162017
STT-RAM buffer design for precision-tunable general-purpose neural network accelerator
L Song, Y Wang, Y Han, H Li, Y Cheng, X Li
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (4 …, 2017
142017
Quantitative evaluation of reliability and performance for STT-MRAM
L Zhang, A Todri-Sanial, W Kang, Y Zhang, L Torres, Y Cheng, W Zhao
2016 IEEE International Symposium on Circuits and Systems (ISCAS), 1150-1153, 2016
132016
Wrapper chain design for testing TSVs minimization in circuit-partitioned 3D SoC
Y Cheng, L Zhang, Y Han, J Liu, X Li
2011 Asian Test Symposium, 181-186, 2011
132011
Reliability and performance evaluation for STT-MRAM under temperature variation
L Zhang, Y Cheng, W Kang, Y Zhang, L Torres, W Zhao, A Todri-Sanial
2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016
112016
HARS: a high-performance reliable routing scheme for 3D NoCs
J Zhou, H Li, Y Fang, T Wang, Y Cheng, X Li
2014 IEEE Computer Society Annual Symposium on VLSI, 392-397, 2014
112014
A study of 3-D power delivery networks with multiple clock domains
A Todri-Sanial, Y Cheng
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (11 …, 2016
102016
Readability challenges in deeply scaled STT-MRAM
W Kang, Y Cheng, Y Zhang, D Ravelosona, W Zhao
2014 14th Annual Non-Volatile Memory Technology Symposium (NVMTS), 1-4, 2014
102014
An adaptive 3T-3MTJ memory cell design for STT-MRAM-based LLCs
L Xue, B Wu, B Zhang, Y Cheng, P Wang, C Park, J Kan, SH Kang, Y Xie
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (3), 484-495, 2018
92018
Odesy: a novel 3t-3mtj cell design with optimized area density, scalability and latency
L Xue, Y Cheng, J Yang, P Wang, Y Xie
2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2016
82016
A body-biasing of readout circuit for STT-RAM with improved thermal reliability
L Yang, Y Cheng, Y Wang, H Yu, W Zhao, A Todri-Sanial
2015 IEEE International Symposium on Circuits and Systems (ISCAS), 1530-1533, 2015
82015
A novel method to mitigate TSV electromigration for 3D ICs
Y Cheng, A Todri-Sanial, A Bosio, L Dillio, P Girard, A Virazel, P Vevet, ...
2013 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 121-126, 2013
82013
TSV Minimization for Circuit—Partitioned 3D SoC Test Wrapper Design
YQ Cheng, L Zhang, YH Han, XW Li
Journal of computer science and technology 28 (1), 119-128, 2013
82013
Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect
Y Cheng, A Todri-Sanial, J Yang, W Zhao
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (11 …, 2016
72016
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