| Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology Y Zhang, CR King, J Zaveri, YJ Kim, V Sahu, Y Joshi, MS Bakir 2011 IEEE 61st electronic components and technology conference (ECTC), 2037-2044, 2011 | 63 | 2011 |
| Hybrid solid state/fluidic cooling for hot spot removal V Sahu, YK Joshi, AG Fedorov Nanoscale and Microscale Thermophysical Engineering 13 (3), 135-150, 2009 | 54 | 2009 |
| Hybrid solid state/fluidic cooling for hot spot removal V. Sahu, Y.K. Joshi, A.G. Fedorov 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2008 | 54* | 2008 |
| Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal V Sahu, AG Fedorov, Y Joshi, K Yazawa, A Ziabari, A Shakouri 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 28 | 2012 |
| Infrared imaging microscope as an effective tool for measuring thermal resistance of emerging interface materials A McNamara, V Sahu, Y Joshi, Z Zhang ASME/JSME Thermal Engineering Joint Conference 38921, T30026, 2011 | 27 | 2011 |
| Experimental investigation of hotspot removal using superlattice cooler V Sahu, YK Joshi, AG Fedorov 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 25 | 2010 |
| Cooling power optimization for hybrid solid-state and liquid cooling in integrated circuit chips with hotspots K Yazawa, A Ziabari, YR Koh, A Shakouri, V Sahu, AG Fedorov, Y Joshi 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 20 | 2012 |
| Experimental characterization of hybrid solid-state and fluidic cooling for thermal management of localized hotspots V Sahu, YK Joshi, AG Fedorov, JH Bahk, X Wang, A Shakouri IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (1 …, 2014 | 19 | 2014 |
| System and method for thermal management of a wearable computing device based on proximity to a user S Vivek, D Le, J Anderson, P Wang, S Wang US Patent 11,042,174, 2021 | 12 | 2021 |
| Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion S Vivek, M Saeidi US Patent 10,649,503, 2020 | 8 | 2020 |
| Passive and active thermal technologies: Modeling and evaluation CE Green, V Sahu, Y Hu, YK Joshi, AG Fedorov Handbook of 3D Integration: Design, Test, and Thermal Management 4, 375-412, 2019 | 7 | 2019 |
| Computational and experimental investigation of thermal coupling between superlattice coolers V Sahu, AG Fedorov, YK Joshi IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (4 …, 2014 | 6 | 2014 |
| Circuits and Methods Providing Thread Assignment for a Multi-Core Processor M Saeidi, S Vivek, T Khadivi, R Coutts, R Alton, P Jain, R Mittal US Patent App. 15/373,067, 2018 | 5 | 2018 |
| Transient characterization of hybrid microfluidic-thermoelectric cooling scheme for dynamic thermal management of microprocessor V Sahu, AG Fedorov, YK Joshi Journal of Electronic Packaging 136 (3), 031014, 2014 | 5 | 2014 |
| Thermal arm for drone S Vivek, M Saeidi, R Mittal, M Roshandell US Patent 10,358,230, 2019 | 3 | 2019 |
| Hybrid solid-state/fluidic cooling for thermal management of electronic components V Sahu Georgia Institute of Technology, 2011 | 3 | 2011 |
| Thermal modulation of an electronic device R Mittal, M Saeidi, S Vivek, R Coutts US Patent 9,943,008, 2018 | 2 | 2018 |
| Enclosure cooling for thermal management of unmanned aerial vehicles P Wang, S Vivek, S Wang, D Le, JJ Anderson, C Chiu US Patent 10,189,554, 2019 | | 2019 |
| Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots V Sahu, YK Joshi, AG Fedorov International Heat Transfer Conference 49385, 681-687, 2010 | | 2010 |
