| Postsilicon voltage guard-band reduction in a 22 nm graphics execution core using adaptive voltage scaling and dynamic power gating M Cho, ST Kim, C Tokunaga, C Augustine, JP Kulkarni, K Ravichandran, ... IEEE Journal of Solid-State Circuits 52 (1), 50-63, 2016 | 90 | 2016 |
| Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 694-697, 2010 | 78 | 2010 |
| Pre-bond and post-bond test and signal recovery structure to characterize and repair TSV defect induced signal degradation in 3-D system M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 71 | 2011 |
| Reconfigurable SRAM architecture with spatial voltage scaling for low power mobile multimedia applications M Cho, J Schlessman, W Wolf, S Mukhopadhyay IEEE transactions on very large scale integration (VLSI) systems 19 (1), 161-165, 2009 | 54 | 2009 |
| An energy-efficient graphics processor featuring fine-grain DVFS with integrated voltage regulators, execution-unit turbo, and retentive sleep in 14nm tri-gate CMOS P Meinerzhagen, C Tokunaga, A Malavasi, V Vaidya, A Mendon, ... 2018 IEEE International Solid-State Circuits Conference-(ISSCC), 38-40, 2018 | 33 | 2018 |
| Accuracy-aware SRAM: A reconfigurable low power SRAM architecture for mobile multimedia applications M Cho, J Schlessman, W Wolf, S Mukhopadhyay 2009 Asia and South Pacific Design Automation Conference, 823-828, 2009 | 30 | 2009 |
| Characterization of radiation-induced SRAM and logic soft errors from 0.33 V to 1.0 V in 65nm CMOS R Pawlowski, J Crop, M Cho, J Tschanz, V De, T Fairbanks, H Quinn, ... Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, 1-4, 2014 | 24 | 2014 |
| Proactive power migration to reduce maximum value and spatiotemporal non-uniformity of on-chip temperature distribution in homogeneous many-core processors M Cho, N Sathe, M Gupta, S Kumar, S Yalamanchilli, S Mukhopadhyay 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 24 | 2010 |
| An Energy-Efficient Graphics Processor in 14-nm Tri-Gate CMOS Featuring Integrated Voltage Regulators for Fine-Grain DVFS, Retentive Sleep, and ${V} _ {\text {MIN}} $ Optimization PA Meinerzhagen, C Tokunaga, A Malavasi, V Vaidya, A Mendon, ... IEEE Journal of Solid-State Circuits 54 (1), 144-157, 2018 | 23 | 2018 |
| Thermal system identification (TSI): A methodology for post-silicon characterization and prediction of the transient thermal field in multicore chips M Cho, W Song, S Yalamanchili, S Mukhopadhyay 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 17 | 2012 |
| Thermal system identification (TSI): A methodology for post-silicon characterization and prediction of the transient thermal field in multicore chips M Cho, W Song, S Yalamanchili, S Mukhopadhyay 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 17 | 2012 |
| Characterization of inverse temperature dependence in logic circuits M Cho, M Khellah, K Chae, K Ahmed, J Tschanz, S Mukhopadhyay Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 1-4, 2012 | 16 | 2012 |
| Analysis of neutron-induced multibit-upset clusters in a 14-nm flip-flop array S Kumar, M Cho, L Everson, Q Tang, P Meinerzhagen, A Malavasi, ... IEEE Transactions on Nuclear Science 66 (6), 918-925, 2019 | 12 | 2019 |
| Thermal investigation into power multiplexing for homogeneous many-core processors M Prakash Gupta, M Cho, S Mukhopadhyay, S Kumar | 12 | 2012 |
| Power multiplexing for thermal field management in many-core processors M Cho, C Kersey, MP Gupta, N Sathe, S Kumar, S Yalamanchili, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (1 …, 2012 | 11 | 2012 |
| Thermal mangament of multicore processors using power multiplexing MP Gupta, M Cho, S Mukhopadhyay, S Kumar 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 11 | 2010 |
| Impact of die-to-die thermal coupling on the electrical characteristics of 3D stacked SRAM cache S Chatterjee, M Cho, R Rao, S Mukhopadhyay 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 10 | 2012 |
| Aging-aware Adaptive Voltage Scaling in 22nm high-K/metal-gate tri-gate CMOS M Cho, C Tokunaga, MM Khellah, JW Tschanz, V De 2015 IEEE Custom Integrated Circuits Conference (CICC), 1-4, 2015 | 9 | 2015 |
| Optimization of burn-in test for many-core processors through adaptive spatiotemporal power migration M Cho, N Sathe, A Raychowdhury, S Mukhopadhyay 2010 IEEE International Test Conference, 1-9, 2010 | 8 | 2010 |
| An All-Digital, -Compliant, Stable, and Scalable Distributed Charge Injection Scheme in 10-nm CMOS for Fast and Local Mitigation of Voltage Droop S Bang, M Cho, PA Meinerzhagen, A Malavasi, MM Khellah, JW Tschanz, ... IEEE Journal of Solid-State Circuits 55 (7), 1898-1908, 2020 | 7 | 2020 |
