| Maintaining alignment in a multi-chip module using a compressible structure HD Thacker, HS Yang, I Shubin, JE Cunningham US Patent 8,742,576, 2014 | 68 | 2014 |
| 3D integration of CMOS and MEMS using mechanically flexible interconnects (MFI) and through silicon vias (TSV) HS Yang, MS Bakir 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 45 | 2010 |
| Design, fabrication, and characterization of freestanding mechanically flexible interconnects using curved sacrificial layer HS Yang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (4 …, 2012 | 33 | 2012 |
| A ‘mesh’seed layer for improved through-silicon-via fabrication JH Lai, HS Yang, H Chen, CR King, J Zaveri, R Ravindran, MS Bakir Journal of Micromechanics and Microengineering 20 (2), 025016, 2010 | 33 | 2010 |
| Highly elastic gold passivated mechanically flexible interconnects C Zhang, HS Yang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 27 | 2013 |
| Self-aligned silicon interposer tiles and silicon bridges using positive self-alignment structures and rematable mechanically flexible interconnects HS Yang, C Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 21 | 2014 |
| Mechanically flexible interconnects (MFIs) with highly scalable pitch C Zhang, HS Yang, MS Bakir Journal of Micromechanics and Microengineering 24 (5), 055024, 2014 | 14 | 2014 |
| Self-alignment structures for heterogeneous 3D integration HS Yang, C Zhang, MS Bakir 2013 IEEE 63rd Electronic Components and Technology Conference, 232-239, 2013 | 11 | 2013 |
| A 3D interconnect system for large biosensor array and CMOS signal-processing IC integration HS Yang, R Ravindran, MS Bakir, JD Meindl 2010 IEEE International Interconnect Technology Conference, 1-3, 2010 | 11 | 2010 |
| Mechanically flexible interconnects with contact tip for rematable heterogeneous system integration C Zhang, HS Yang, HD Thacker, I Shubin, JE Cunningham, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 10 | 2016 |
| Chip-to-chip interconnect integration technologies M Zia, C Zhang, HS Yang, L Zheng, M Bakir IEICE Electronics Express 13 (6), 20162001-20162001, 2016 | 10 | 2016 |
| Effects of the mating system on retail cut yield and meat quality in commercial pigs HS Kim, HS Yang, JI Lee, ST Joo, JT Jeon, JG Lee Journal of Animal Science and Technology 49 (3), 379-386, 2007 | 10 | 2007 |
| A self-aligning flip-chip assembly method using sacrificial positive self-alignment structures HS Yang, C Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (3 …, 2016 | 9 | 2016 |
| Gold passivated mechanically flexible interconnects (MFIs) with high elastic deformation C Zhang, HS Yang, MS Bakir 2012 IEEE 62nd Electronic Components and Technology Conference, 245-250, 2012 | 9 | 2012 |
| Biochemical sensing with an arrayed silicon nanowire platform R Ravindran, JA Sadie, KE Scarberry, HS Yang, MS Bakir, JF McDonald, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 9 | 2010 |
| Wafer level batch fabrication of silicon microchannel heat sink and electrical through-silicon vias for 3D ICs J Zaveri, CR King, HS Yang, MS Bakir IMAPS 42nd International Symposium on Microelectronics, 2009 | 8 | 2009 |
| Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge HS Yang, C Zhang, M Zia, L Zheng, MS Bakir 2014 Optical Interconnects Conference, 71-72, 2014 | 6 | 2014 |
| Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection C Zhang, HS Yang, MS Bakir 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 13-19, 2014 | 5 | 2014 |
| A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects C Zhang, HS Yang, MS Bakir Journal of Micromechanics and Microengineering 27 (2), 025014, 2017 | 4 | 2017 |
| Revolutionary innovation in system interconnection: a new era for the IC MS Bakir, PA Thadesar, C King, J Zaveri, HS Yang, C Zhang, Y Zhang Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and …, 2011 | 3 | 2011 |
Chaoqi ZhangElectrical Engineering, Georgia Institute of Technologygatech.edu üzerinde doğrulanmış e-posta adresine sahip
