| Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering D Lorenzini, C Green, TE Sarvey, X Zhang, Y Hu, AG Fedorov, MS Bakir, ... International Journal of Heat and Mass Transfer 103, 1359-1370, 2016 | 95 | 2016 |
| A review of two-phase forced cooling in three-dimensional stacked electronics: technology integration C Green, P Kottke, X Han, C Woodrum, T Sarvey, P Asrar, X Zhang, ... Journal of Electronic Packaging 137 (4), 040802, 2015 | 72 | 2015 |
| Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hot spot-level thermal management C Green, AG Fedorov, YK Joshi | 59 | 2009 |
| Integrated circuit cooling using heterogeneous micropin-fin arrays for nonuniform power maps TE Sarvey, Y Hu, CE Green, PA Kottke, DC Woodrum, YK Joshi, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 43 | 2017 |
| Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ... International Journal of Heat and Mass Transfer 108, 1702-1713, 2017 | 39 | 2017 |
| Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins P Asrar, X Zhang, CE Green, M Bakir, YK Joshi International Journal of Heat and Mass Transfer 121, 329-342, 2018 | 37 | 2018 |
| Two-phase convective cooling for ultrahigh power dissipation in microprocessors PA Kottke, TM Yun, CE Green, YK Joshi, AG Fedorov Journal of Heat Transfer 138 (1), 011501, 2016 | 28 | 2016 |
| Hotspot thermal management with flow boiling of refrigerant in ultrasmall microgaps MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ... Journal of Electronic Packaging 139 (1), 011006, 2017 | 26 | 2017 |
| Devices including composite thermal capacitors AG Fedorov, C Green, Y Joshi US Patent 8,378,453, 2013 | 26 | 2013 |
| Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ... Journal of Electronic Packaging 138 (1), 010910, 2016 | 18 | 2016 |
| Time scale matching of dynamically operated devices using composite thermal capacitors CE Green, AG Fedorov, YK Joshi Microelectronics Journal 45 (8), 1069-1078, 2014 | 18 | 2014 |
| Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management R Abbaspour, DC Woodrum, PA Kottke, TE Sarvey, CE Green, YK Joshi, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 17 | 2016 |
| Scaling analysis of performance trade-offs in electronics cooling CE Green, AG Fedorov, YK Joshi International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 15 | 2009 |
| Flow boiling of R245fa in a microgap with integrated staggered pin fins P Asrar, X Zhang, CD Woodrum, CE Green, PA Kottke, TE Sarvey, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 14 | 2016 |
| Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins P Asrar, X Zhang, CE Green, PA Kottke, TE Sarvey, A Fedorov, MS Bakir, ... 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016 | 12 | 2016 |
| Dynamic thermal management of high heat flux devices using embedded solid-liquid phase change materials and solid state coolers CE Green, AG Fedorov, YK Joshi 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 11 | 2012 |
| Carbon nanotube-based thermal interface materials and methods of making and using thereof B Cola, C Green, L Prinzi US Patent 10,461,015, 2019 | 10 | 2019 |
| 3D IC with embedded microfluidic cooling: technology, thermal performance, and electrical implications X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ... International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 10 | 2015 |
| Devices including composite thermal capacitors AG Fedorov, C Green, Y Joshi US Patent 8,710,625, 2014 | 9 | 2014 |
| Performance and integration implications of addressing localized hotspots through two approaches: Clustering of micro pin-fins and dedicated microgap coolers CE Green, PA Kottke, TE Sarvey, AG Fedorov, Y Joshi, MS Bakir International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 8 | 2015 |
