| A broadband direct conversion transmitter/receiver at D-band using CMOS 22nm FDSOI AA Farid, A Simsek, ASH Ahmed, MJW Rodwell 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 135-138, 2019 | 96 | 2019 |
| A 140GHz power amplifier with 20.5 dBm output power and 20.8% PAE in 250-nm InP HBT technology ASH Ahmed, M Seo, AA Farid, M Urteaga, JF Buckwalter, MJW Rodwell 2020 IEEE/MTT-S International Microwave Symposium (IMS), 492-495, 2020 | 62 | 2020 |
| A fully packaged 135-GHz multiuser MIMO transmitter array tile for wireless communications AA Farid, ASH Ahmed, A Dhananjay, MJW Rodwell IEEE Transactions on Microwave Theory and Techniques 70 (7), 3396-3405, 2022 | 47 | 2022 |
| A 200mW D-band Power Amplifier with 17.8% PAE in 250-nm InP HBT Technology ASH Ahmed, M Seo, AA Farid, M Urteaga, JF Buckwalter, MJW Rodwell 2020 15th European Microwave Integrated Circuits Conference (EuMIC), 1-4, 2021 | 46 | 2021 |
| A compact H-band power amplifier with high output power ASH Ahmed, U Soylu, M Seo, M Urteaga, MJW Rodwell 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 123-126, 2021 | 34 | 2021 |
| Prospects for high-efficiency silicon and lll-V power amplifiers and transmitters in 100-300 GHz bands JF Buckwalter, MJW Rodwell, K Ning, A Ahmed, A Arias-Purdue, J Chien, ... 2021 IEEE Custom Integrated Circuits Conference (CICC), 1-7, 2021 | 25 | 2021 |
| A 190-210GHz Power Amplifier with 17.7-18.5 dBm Output Power and 6.9-8.5% PAE ASH Ahmed, U Soylu, M Seo, M Urteaga, JF Buckwalter, MJW Rodwell 2021 IEEE MTT-S International Microwave Symposium (IMS), 787-790, 2021 | 23 | 2021 |
| A 27.5 dBm EIRP D-band transmitter module on a ceramic interposer AA Farid, ASH Ahmed, MJW Rodwell 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 43-46, 2021 | 22 | 2021 |
| Ic and array technologies for 100-300ghz wireless MJW Rodwell, ASH Ahmed, M Seo, U Soylu, A Alizadeh, N Hosseinzadeh 2022 IEEE Custom Integrated Circuits Conference (CICC), 01-05, 2022 | 20 | 2022 |
| A 146.7 GHz transceiver with 5 GBaud data transmission using a low-cost series-fed patch antenna array through wirebonding integration A Simsek, SK Kim, M Abdelghany, ASH Ahmed, AA Farid, U Madhow, ... 2020 IEEE Radio and Wireless Symposium (RWS), 68-71, 2020 | 20 | 2020 |
| 8.6-13.6 mW series-connected power amplifiers designed at 325 GHz using 130 nm InP HBT technology ASH Ahmed, A Simsek, M Urteaga, MJW Rodwell 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2018 | 20 | 2018 |
| 204GHz stacked-power amplifiers designed by a novel two-port technique ASH Ahmed, AA Farid, M Urteaga, MJW Rodwell 2018 13th European Microwave Integrated Circuits Conference (EuMIC), 29-32, 2018 | 20 | 2018 |
| 100-300ghz wireless: Ics, arrays, and systems MJW Rodwell, AA Farid, ASH Ahmed, M Seo, U Soylu, A Alizadeh, ... 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2021 | 19 | 2021 |
| A packaged 135GHz 22nm FD-SOI transmitter on an LTCC carrier AA Farid, ASH Ahmed, A Simsek, MJW Rodwell 2021 IEEE MTT-S International Microwave Symposium (IMS), 713-716, 2021 | 16 | 2021 |
| A 140GHz two-channel CMOS transmitter using low-cost packaging technologies A Simsek, ASH Ahmed, AA Farid, U Soylu, MJW Rodwell 2020 IEEE Wireless Communications and Networking Conference Workshops (WCNCW …, 2020 | 16 | 2020 |
| A 200 GHz InP HBT direct-conversion LO-phase-shifted transmitter/receiver with 15 dBm output power M Seo, ASH Ahmed, U Soylu, A Farid, Y Na, M Rodwell 2021 IEEE MTT-S International Microwave Symposium (IMS), 378-381, 2021 | 14 | 2021 |
| 135GHz CMOS/LTCC MIMO receiver array tile modules AA Farid, ASH Ahmed, A Dhananjay, P Skrimponis, S Rangan, M Rodwell 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2021 | 13 | 2021 |
| 200 GHz low noise amplifiers in 250 nm InP HBT technology U Soylu, ASH Ahmed, M Seo, A Farid, M Rodwell 2021 16th European Microwave Integrated Circuits Conference (EuMIC), 129-132, 2022 | 11 | 2022 |
| A 2-stage, 140-GHz class-B power amplifier achieving 22.5% PAE at 17.3 dBm in a 250-nm InP HBT technology E Lam, K Ning, A Ahmed, M Rodwell, J Buckwalter 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 448-451, 2022 | 7 | 2022 |
| A multi-stage 19.2-dBm, 30.4%-PAE D-band power amplifier in a 250-nm InP HBT process E Lam, K Ning, ASH Ahmed, M Rodwell, JF Buckwalter 2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 1042-1045, 2023 | 6 | 2023 |
Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa Barbaraece.ucsb.edu üzerinde doğrulanmış e-posta adresine sahip
