Moongon Jung
Moongon Jung
gatech.edu üzerinde doğrulanmış e-posta adresine sahip
Başlık
Alıntı yapanlar
Alıntı yapanlar
Yıl
3D-MAPS: 3D Massively parallel processor with stacked memory
DH Kim, K Athikulwongse, M Healy, M Hossain, M Jung, I Khorosh, ...
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 …, 2012
2052012
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
M Jung, J Mitra, DZ Pan, SK Lim
Communications of the ACM 57 (1), 107-115, 2014
1552014
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory
MB Healy, K Athikulwongse, R Goel, MM Hossain, DH Kim, YJ Lee, ...
Proc. of CICC, 2010
942010
Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory)
DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ...
IEEE Transactions on Computers 64 (1), 112-125, 2013
632013
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3-D IC
M Jung, J Mitra, DZ Pan, SK Lim
IEEE Transactions on Computer-aided design of integrated circuits and …, 2012
522012
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC
M Jung, X Liu, SK Sitaraman, DZ Pan, SK Lim
Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on …, 2011
442011
A study of IR-drop noise issues in 3D ICs with through-silicon-vias
M Jung, SK Lim
2010 IEEE International 3D Systems Integration Conference (3DIC), 1-7, 2010
402010
Design for Manufacturability and Reliability for TSV-based 3D ICs
DZ Pan, SK Lim, K Athikulwongse, M Jung, J Mitra, J Pak, M Pathak, ...
Design Automation Conference (ASP-DAC), 2012 17th Asia and South Pacific …, 2012
352012
On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective
M Jung, T Song, Y Wan, Y Peng, SK Lim
2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC), 1-6, 2014
342014
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core
M Jung, T Song, Y Wan, YJ Lee, D Mohapatra, H Wang, G Taylor, ...
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 1-4, 2013
242013
Impact of size effects in local interconnects for future technology nodes: A study based on full-chip layouts
A Ceyhan, M Jung, S Panth, SK Lim, A Naeemi
IEEE International Interconnect Technology Conference, 345-348, 2014
222014
A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs
J Mitra, M Jung, SK Ryu, R Huang, SK Lim, DZ Pan
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 746-753, 2011
222011
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
M Jung, DZ Pan, SK Lim
Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE, 317-326, 2012
182012
Impact of mechanical stress on the full chip timing for through-silicon-via-based 3-D ICs
K Athikulwongse, JS Yang, DZ Pan, SK Lim
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013
162013
Chip/package mechanical stress impact on 3-D IC reliability and mobility variations
M Jung, DZ Pan, SK Lim
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013
142013
Evaluating Chip-Level Impact of Cu/Low-Performance Degradation on Circuit Performance at Future Technology Nodes
A Ceyhan, M Jung, S Panth, SK Lim, A Naeemi
IEEE Transactions on Electron Devices 62 (3), 940-946, 2015
102015
Design methodologies for low-power 3-D ICs with advanced tier partitioning
M Jung, T Song, Y Peng, SK Lim
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (7 …, 2017
92017
Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs
K Athikulwongse, DH Kim, M Jung, SK Lim
2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC), 687-692, 2013
92013
A study of TSV variation impact on power supply noise
M Jung, S Panth, SK Lim
2011 IEEE International Interconnect Technology Conference, 1-3, 2011
92011
Fine-grained 3-D IC partitioning study with a multicore processor
M Jung, T Song, Y Peng, SK Lim
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015
62015
Sistem, işlemi şu anda gerçekleştiremiyor. Daha sonra yeniden deneyin.
Makaleler 1–20